skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Micro heat barrier

Abstract

A highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to a substrate. An infrared reflective membrane (e.g., 1 micron gold) can be supported by the array of microsupports to provide radiation shielding. The micro heat barrier can be evacuated to eliminate gas phase heat conduction and convection. Semi-isotropic, reactive ion plasma etching can be used to create a microspike having a cusp-like shape with a sharp, pointed tip (<0.1 micron), to minimize the tip's contact area. A heat source can be placed directly on the microspikes. The micro heat barrier can have an apparent thermal conductivity in the range of 10.sup.-6 to 10.sup.-7 W/m-K. Multiple layers of reflective membranes can be used to increase thermal resistance.

Inventors:
; ; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1174442
Patent Number(s):
6,605,339
Application Number:
10/025,449
Assignee:
Sandia Corporation (Albuquerque, NM) SNL-L
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY

Citation Formats

Marshall, Albert C., Kravitz, Stanley H., Tigges, Chris P., and Vawter, Gregory A. Micro heat barrier. United States: N. p., 2003. Web.
Marshall, Albert C., Kravitz, Stanley H., Tigges, Chris P., & Vawter, Gregory A. Micro heat barrier. United States.
Marshall, Albert C., Kravitz, Stanley H., Tigges, Chris P., and Vawter, Gregory A. Tue . "Micro heat barrier". United States. https://www.osti.gov/servlets/purl/1174442.
@article{osti_1174442,
title = {Micro heat barrier},
author = {Marshall, Albert C. and Kravitz, Stanley H. and Tigges, Chris P. and Vawter, Gregory A.},
abstractNote = {A highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to a substrate. An infrared reflective membrane (e.g., 1 micron gold) can be supported by the array of microsupports to provide radiation shielding. The micro heat barrier can be evacuated to eliminate gas phase heat conduction and convection. Semi-isotropic, reactive ion plasma etching can be used to create a microspike having a cusp-like shape with a sharp, pointed tip (<0.1 micron), to minimize the tip's contact area. A heat source can be placed directly on the microspikes. The micro heat barrier can have an apparent thermal conductivity in the range of 10.sup.-6 to 10.sup.-7 W/m-K. Multiple layers of reflective membranes can be used to increase thermal resistance.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {8}
}

Patent:

Save / Share: