Micro heat barrier
Abstract
A highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to a substrate. An infrared reflective membrane (e.g., 1 micron gold) can be supported by the array of microsupports to provide radiation shielding. The micro heat barrier can be evacuated to eliminate gas phase heat conduction and convection. Semi-isotropic, reactive ion plasma etching can be used to create a microspike having a cusp-like shape with a sharp, pointed tip (<0.1 micron), to minimize the tip's contact area. A heat source can be placed directly on the microspikes. The micro heat barrier can have an apparent thermal conductivity in the range of 10.sup.-6 to 10.sup.-7 W/m-K. Multiple layers of reflective membranes can be used to increase thermal resistance.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1174442
- Patent Number(s):
- 6605339
- Application Number:
- 10/025,449
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY
Citation Formats
Marshall, Albert C., Kravitz, Stanley H., Tigges, Chris P., and Vawter, Gregory A. Micro heat barrier. United States: N. p., 2003.
Web.
Marshall, Albert C., Kravitz, Stanley H., Tigges, Chris P., & Vawter, Gregory A. Micro heat barrier. United States.
Marshall, Albert C., Kravitz, Stanley H., Tigges, Chris P., and Vawter, Gregory A. Tue .
"Micro heat barrier". United States. https://www.osti.gov/servlets/purl/1174442.
@article{osti_1174442,
title = {Micro heat barrier},
author = {Marshall, Albert C. and Kravitz, Stanley H. and Tigges, Chris P. and Vawter, Gregory A.},
abstractNote = {A highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to a substrate. An infrared reflective membrane (e.g., 1 micron gold) can be supported by the array of microsupports to provide radiation shielding. The micro heat barrier can be evacuated to eliminate gas phase heat conduction and convection. Semi-isotropic, reactive ion plasma etching can be used to create a microspike having a cusp-like shape with a sharp, pointed tip (<0.1 micron), to minimize the tip's contact area. A heat source can be placed directly on the microspikes. The micro heat barrier can have an apparent thermal conductivity in the range of 10.sup.-6 to 10.sup.-7 W/m-K. Multiple layers of reflective membranes can be used to increase thermal resistance.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 12 00:00:00 EDT 2003},
month = {Tue Aug 12 00:00:00 EDT 2003}
}
Works referenced in this record:
Recent Developments in Contact Conductance Heat Transfer
journal, November 1988
- Fletcher, L. S.
- Journal of Heat Transfer, Vol. 110, Issue 4b