High thermal conductivity lossy dielectric using co-densified multilayer configuration

Title: High thermal conductivity lossy dielectric using co-densified multilayer configuration

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Abstract

Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.

Inventors:: Tiegs, Terry N.; Kiggans, Jr., James O.

Issue Date:: 2003-06-17

Research Org.:: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1174377

Patent Number(s):: 6,579,393

Application Number:: 09/837,891

Assignee:: Lockheed Martin Energy Research Corporation (Oak Ridge, TN) OSTI

DOE Contract Number:: AC05-96OR22464

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY

Citation Formats


                    Tiegs, Terry N., and Kiggans, Jr., James O. High thermal conductivity lossy dielectric using co-densified multilayer configuration.  United States: N. p., 2003. 
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                    Tiegs, Terry N., & Kiggans, Jr., James O. High thermal conductivity lossy dielectric using co-densified multilayer configuration.  United States.

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                    Tiegs, Terry N., and Kiggans, Jr., James O. Tue .  
        "High thermal conductivity lossy dielectric using co-densified multilayer configuration".  United States.  https://www.osti.gov/servlets/purl/1174377.

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@article{osti_1174377,

  title        = {High thermal conductivity lossy dielectric using co-densified multilayer configuration},

  author       = {Tiegs, Terry N. and Kiggans, Jr., James O.},

  abstractNote = {Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2003},

  month        = {6}

}

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