High thermal conductivity lossy dielectric using co-densified multilayer configuration

Tiegs, Terry N.; Kiggans, James O.

Title: High thermal conductivity lossy dielectric using co-densified multilayer configuration

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Abstract

Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.

Inventors:: Tiegs, Terry N.; Kiggans, Jr., James O.

Issue Date:: 2003-06-17

Research Org.:: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1174377

Patent Number(s):: 6579393

Application Number:: 09/837,891

Assignee:: Lockheed Martin Energy Research Corporation (Oak Ridge, TN)

Patent Classifications (CPCs):: C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS

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C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA
C04B2237/363 - Carbon
C04B2237/84 - Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube
C04B2237/704 - of one or more of the ceramic layers or articles
C04B2237/34 - Oxidic
C04B2235/6565 - Cooling rate

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
H01J23/54 - Filtering devices preventing unwanted frequencies or modes to be coupled to, or out of, the interaction circuit

C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA
C04B35/645 - Pressure sintering
C04B2235/9607 - Thermal properties, e.g. thermal expansion coefficient
C04B35/638 - Removal thereof
C04B2235/3826 - Silicon carbides
C04B35/581 - based on aluminium nitride
C04B2237/368 - Silicon nitride
C04B2235/6567 - Treatment time
C04B2235/3225 - Yttrium oxide or oxide-forming salts thereof
C04B35/63424 - {Polyacrylates
C04B2235/6562 - Heating rate
C04B35/575 - obtained by pressure sintering
C04B2235/662 - Annealing after sintering
C04B2235/6025 - Tape casting, e.g. with a doctor blade
C04B2237/365 - Silicon carbide
C04B2235/668 - Pressureless sintering
C04B2237/36 - Non-oxidic
C04B2235/9615 - Linear firing shrinkage
C04B35/632 - Organic additives

B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
B32B18/00 - Layered products essentially comprising ceramics, e.g. refractory products

C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA
C04B2237/366 - Aluminium nitride
C04B2235/77 - Density
C04B2235/3865 - Aluminium nitrides
C04B2237/525 - by heating

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DOE Contract Number:: AC05-96OR22464

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY

Citation Formats


                    Tiegs, Terry N., and Kiggans, Jr., James O. High thermal conductivity lossy dielectric using co-densified multilayer configuration.  United States: N. p., 2003. 
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                    Tiegs, Terry N., & Kiggans, Jr., James O. High thermal conductivity lossy dielectric using co-densified multilayer configuration.  United States.

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                    Tiegs, Terry N., and Kiggans, Jr., James O. Tue .  
        "High thermal conductivity lossy dielectric using co-densified multilayer configuration".  United States.  https://www.osti.gov/servlets/purl/1174377.

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@article{osti_1174377,

  title        = {High thermal conductivity lossy dielectric using co-densified multilayer configuration},

  author       = {Tiegs, Terry N. and Kiggans, Jr., James O.},

  abstractNote = {Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2003},

  month        = {6}

}

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