Method and system for automated on-chip material and structural certification of MEMS devices
Abstract
A new approach toward MEMS quality control and materials characterization is provided by a combined test structure measurement and mechanical response modeling approach. Simple test structures are cofabricated with the MEMS devices being produced. These test structures are designed to isolate certain types of physical response, so that measurement of their behavior under applied stress can be easily interpreted as quality control and material properties information.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1174341
- Patent Number(s):
- 6567715
- Application Number:
- 09/553,989
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Sinclair, Michael B., DeBoer, Maarten P., Smith, Norman F., Jensen, Brian D., and Miller, Samuel L. Method and system for automated on-chip material and structural certification of MEMS devices. United States: N. p., 2003.
Web.
Sinclair, Michael B., DeBoer, Maarten P., Smith, Norman F., Jensen, Brian D., & Miller, Samuel L. Method and system for automated on-chip material and structural certification of MEMS devices. United States.
Sinclair, Michael B., DeBoer, Maarten P., Smith, Norman F., Jensen, Brian D., and Miller, Samuel L. Tue .
"Method and system for automated on-chip material and structural certification of MEMS devices". United States. https://www.osti.gov/servlets/purl/1174341.
@article{osti_1174341,
title = {Method and system for automated on-chip material and structural certification of MEMS devices},
author = {Sinclair, Michael B. and DeBoer, Maarten P. and Smith, Norman F. and Jensen, Brian D. and Miller, Samuel L.},
abstractNote = {A new approach toward MEMS quality control and materials characterization is provided by a combined test structure measurement and mechanical response modeling approach. Simple test structures are cofabricated with the MEMS devices being produced. These test structures are designed to isolate certain types of physical response, so that measurement of their behavior under applied stress can be easily interpreted as quality control and material properties information.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {5}
}