skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Conformal chemically resistant coatings for microflow devices

Abstract

A process for coating the inside surfaces of silicon microflow devices, such as electrophoresis microchannels, with a low-stress, conformal (uniform) silicon nitride film which has the ability to uniformly coat deeply-recessed cavities with, for example, aspect ratios of up to 40:1 or higher. The silicon nitride coating allows extended exposure to caustic solutions. The coating enables a microflow device fabricated in silicon to be resistant to all classes of chemicals: acids, bases, and solvents. The process involves low-pressure (vacuum) chemical vapor deposition. The ultra-low-stress silicon nitride deposition process allows 1-2 .mu.m thick films without cracks, and so enables extended chemical protection of a silicon microflow device against caustics for up to 1 year. Tests have demonstrated the resistance of the films to caustic solutions at both ambient and elevated temperatures to 65.degree. C.

Inventors:
;
Issue Date:
Research Org.:
The Regents of the University of California, Oakland, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1174320
Patent Number(s):
6,562,404
Application Number:
09/645,826
Assignee:
The Regents of the University of California (Oakland, CA) OSTI
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Folta, James A., and Zdeblick, Mark. Conformal chemically resistant coatings for microflow devices. United States: N. p., 2003. Web.
Folta, James A., & Zdeblick, Mark. Conformal chemically resistant coatings for microflow devices. United States.
Folta, James A., and Zdeblick, Mark. Tue . "Conformal chemically resistant coatings for microflow devices". United States. https://www.osti.gov/servlets/purl/1174320.
@article{osti_1174320,
title = {Conformal chemically resistant coatings for microflow devices},
author = {Folta, James A. and Zdeblick, Mark},
abstractNote = {A process for coating the inside surfaces of silicon microflow devices, such as electrophoresis microchannels, with a low-stress, conformal (uniform) silicon nitride film which has the ability to uniformly coat deeply-recessed cavities with, for example, aspect ratios of up to 40:1 or higher. The silicon nitride coating allows extended exposure to caustic solutions. The coating enables a microflow device fabricated in silicon to be resistant to all classes of chemicals: acids, bases, and solvents. The process involves low-pressure (vacuum) chemical vapor deposition. The ultra-low-stress silicon nitride deposition process allows 1-2 .mu.m thick films without cracks, and so enables extended chemical protection of a silicon microflow device against caustics for up to 1 year. Tests have demonstrated the resistance of the films to caustic solutions at both ambient and elevated temperatures to 65.degree. C.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {5}
}

Patent:

Save / Share: