Conformal chemically resistant coatings for microflow devices
Abstract
A process for coating the inside surfaces of silicon microflow devices, such as electrophoresis microchannels, with a low-stress, conformal (uniform) silicon nitride film which has the ability to uniformly coat deeply-recessed cavities with, for example, aspect ratios of up to 40:1 or higher. The silicon nitride coating allows extended exposure to caustic solutions. The coating enables a microflow device fabricated in silicon to be resistant to all classes of chemicals: acids, bases, and solvents. The process involves low-pressure (vacuum) chemical vapor deposition. The ultra-low-stress silicon nitride deposition process allows 1-2 .mu.m thick films without cracks, and so enables extended chemical protection of a silicon microflow device against caustics for up to 1 year. Tests have demonstrated the resistance of the films to caustic solutions at both ambient and elevated temperatures to 65.degree. C.
- Inventors:
- Issue Date:
- Research Org.:
- The Regents of the University of California, Oakland, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1174320
- Patent Number(s):
- 6,562,404
- Application Number:
- 09/645,826
- Assignee:
- The Regents of the University of California (Oakland, CA) OSTI
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Folta, James A., and Zdeblick, Mark. Conformal chemically resistant coatings for microflow devices. United States: N. p., 2003.
Web.
Folta, James A., & Zdeblick, Mark. Conformal chemically resistant coatings for microflow devices. United States.
Folta, James A., and Zdeblick, Mark. Tue .
"Conformal chemically resistant coatings for microflow devices". United States. https://www.osti.gov/servlets/purl/1174320.
@article{osti_1174320,
title = {Conformal chemically resistant coatings for microflow devices},
author = {Folta, James A. and Zdeblick, Mark},
abstractNote = {A process for coating the inside surfaces of silicon microflow devices, such as electrophoresis microchannels, with a low-stress, conformal (uniform) silicon nitride film which has the ability to uniformly coat deeply-recessed cavities with, for example, aspect ratios of up to 40:1 or higher. The silicon nitride coating allows extended exposure to caustic solutions. The coating enables a microflow device fabricated in silicon to be resistant to all classes of chemicals: acids, bases, and solvents. The process involves low-pressure (vacuum) chemical vapor deposition. The ultra-low-stress silicon nitride deposition process allows 1-2 .mu.m thick films without cracks, and so enables extended chemical protection of a silicon microflow device against caustics for up to 1 year. Tests have demonstrated the resistance of the films to caustic solutions at both ambient and elevated temperatures to 65.degree. C.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {5}
}