Thin film application device and method for coating small aperture vacuum vessels
Abstract
A device and method for coating an inside surface of a vessel is provided. In one embodiment, a coating device comprises a power supply and a diode in electrical communication with the power supply, wherein electrodes comprising the diode reside completely within the vessel. The method comprises reversibly sealing electrodes in a vessel, sputtering elemental metal or metal compound on the surface while maintaining the surface in a controlled atmosphere.
- Inventors:
- Issue Date:
- Research Org.:
- Argonne National Laboratory (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1168692
- Patent Number(s):
- 8940140
- Application Number:
- 11/850,409
- Assignee:
- Uchicago Argonne, LLC (Chicago, IL)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 47 OTHER INSTRUMENTATION; 36 MATERIALS SCIENCE
Citation Formats
Walters, Dean R, and Este, Grantley O. Thin film application device and method for coating small aperture vacuum vessels. United States: N. p., 2015.
Web.
Walters, Dean R, & Este, Grantley O. Thin film application device and method for coating small aperture vacuum vessels. United States.
Walters, Dean R, and Este, Grantley O. Tue .
"Thin film application device and method for coating small aperture vacuum vessels". United States. https://www.osti.gov/servlets/purl/1168692.
@article{osti_1168692,
title = {Thin film application device and method for coating small aperture vacuum vessels},
author = {Walters, Dean R and Este, Grantley O},
abstractNote = {A device and method for coating an inside surface of a vessel is provided. In one embodiment, a coating device comprises a power supply and a diode in electrical communication with the power supply, wherein electrodes comprising the diode reside completely within the vessel. The method comprises reversibly sealing electrodes in a vessel, sputtering elemental metal or metal compound on the surface while maintaining the surface in a controlled atmosphere.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {1}
}
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