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Title: Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)

Abstract

Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

Inventors:
; ; ; ; ; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1165428
Patent Number(s):
8913384
Application Number:
13/527,947
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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DOE Contract Number:  
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Jun 20
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION

Citation Formats

David, Milnes P, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Parida, Pritish R, and Schmidt, Roger R. Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s). United States: N. p., 2014. Web.
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David, Milnes P, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Parida, Pritish R, & Schmidt, Roger R. Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s). United States.
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David, Milnes P, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Parida, Pritish R, and Schmidt, Roger R. Tue . "Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)". United States. https://www.osti.gov/servlets/purl/1165428.
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@article{osti_1165428,
title = {Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)},
author = {David, Milnes P and Graybill, David P and Iyengar, Madhusudan K and Kamath, Vinod and Kochuparambil, Bejoy J and Parida, Pritish R and Schmidt, Roger R},
abstractNote = {Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {12}
}
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Works referenced in this record:

Liquid DIMM Cooler
patent-application, November 2006

Liquid Cooling System
patent-application, April 2010

Packaging design of the IBM System z10 Enterprise Class platform central electronic complex
journal, January 2009

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