Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
Abstract
Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1165428
- Patent Number(s):
- 8913384
- Application Number:
- 13/527,947
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- DOE Contract Number:
- EE0002894
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2012 Jun 20
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
Citation Formats
David, Milnes P, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Parida, Pritish R, and Schmidt, Roger R. Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s). United States: N. p., 2014.
Web.
David, Milnes P, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Parida, Pritish R, & Schmidt, Roger R. Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s). United States.
David, Milnes P, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Parida, Pritish R, and Schmidt, Roger R. Tue .
"Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)". United States. https://www.osti.gov/servlets/purl/1165428.
@article{osti_1165428,
title = {Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)},
author = {David, Milnes P and Graybill, David P and Iyengar, Madhusudan K and Kamath, Vinod and Kochuparambil, Bejoy J and Parida, Pritish R and Schmidt, Roger R},
abstractNote = {Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {12}
}
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