Focal plane array with modular pixel array components for scalability
Abstract
A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1165103
- Patent Number(s):
- 8907439
- Application Number:
- 13/163,909
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2011 Jun 20
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 47 OTHER INSTRUMENTATION; 42 ENGINEERING
Citation Formats
Kay, Randolph R, Campbell, David V, Shinde, Subhash L, Rienstra, Jeffrey L, Serkland, Darwin K, and Holmes, Michael L. Focal plane array with modular pixel array components for scalability. United States: N. p., 2014.
Web.
Kay, Randolph R, Campbell, David V, Shinde, Subhash L, Rienstra, Jeffrey L, Serkland, Darwin K, & Holmes, Michael L. Focal plane array with modular pixel array components for scalability. United States.
Kay, Randolph R, Campbell, David V, Shinde, Subhash L, Rienstra, Jeffrey L, Serkland, Darwin K, and Holmes, Michael L. Tue .
"Focal plane array with modular pixel array components for scalability". United States. https://www.osti.gov/servlets/purl/1165103.
@article{osti_1165103,
title = {Focal plane array with modular pixel array components for scalability},
author = {Kay, Randolph R and Campbell, David V and Shinde, Subhash L and Rienstra, Jeffrey L and Serkland, Darwin K and Holmes, Michael L},
abstractNote = {A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {12}
}
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