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Title: Synthesis of polyoxometalate-loaded epoxy composites

Abstract

The synthesis of a polyoxometalate-loaded epoxy uses a one-step cure by applying an external stimulus to release the acid from the polyoxometalate and thereby catalyze the cure reaction of the epoxy resin. Such polyoxometalate-loaded epoxy composites afford the cured epoxy unique properties imparted by the intrinsic properties of the polyoxometalate. For example, polyoxometalate-loaded epoxy composites can be used as corrosion resistant epoxy coatings, for encapsulation of electronics with improved dielectric properties, and for structural applications with improved mechanical properties.

Inventors:
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1160134
Patent Number(s):
8,853,350
Application Number:
13/625,969
Assignee:
Sandia Corporation (Albuquerque, NM)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Sep 25
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Anderson, Benjamin J. Synthesis of polyoxometalate-loaded epoxy composites. United States: N. p., 2014. Web.
Anderson, Benjamin J. Synthesis of polyoxometalate-loaded epoxy composites. United States.
Anderson, Benjamin J. Tue . "Synthesis of polyoxometalate-loaded epoxy composites". United States. https://www.osti.gov/servlets/purl/1160134.
@article{osti_1160134,
title = {Synthesis of polyoxometalate-loaded epoxy composites},
author = {Anderson, Benjamin J},
abstractNote = {The synthesis of a polyoxometalate-loaded epoxy uses a one-step cure by applying an external stimulus to release the acid from the polyoxometalate and thereby catalyze the cure reaction of the epoxy resin. Such polyoxometalate-loaded epoxy composites afford the cured epoxy unique properties imparted by the intrinsic properties of the polyoxometalate. For example, polyoxometalate-loaded epoxy composites can be used as corrosion resistant epoxy coatings, for encapsulation of electronics with improved dielectric properties, and for structural applications with improved mechanical properties.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {10}
}

Patent:

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