High throughput solar cell ablation system
Abstract
A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.
- Inventors:
- Issue Date:
- Research Org.:
- SunPower Corporation, San Jose, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1160130
- Patent Number(s):
- 8,859,933
- Application Number:
- 13/584,613
- Assignee:
- SunPower Corporation (San Jose, CA)
- DOE Contract Number:
- FC36-07GO17043
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2012 Aug 13
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 14 SOLAR ENERGY
Citation Formats
Harley, Gabriel, Pass, Thomas, Cousins, Peter John, and Viatella, John. High throughput solar cell ablation system. United States: N. p., 2014.
Web.
Harley, Gabriel, Pass, Thomas, Cousins, Peter John, & Viatella, John. High throughput solar cell ablation system. United States.
Harley, Gabriel, Pass, Thomas, Cousins, Peter John, and Viatella, John. Tue .
"High throughput solar cell ablation system". United States. https://www.osti.gov/servlets/purl/1160130.
@article{osti_1160130,
title = {High throughput solar cell ablation system},
author = {Harley, Gabriel and Pass, Thomas and Cousins, Peter John and Viatella, John},
abstractNote = {A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {10}
}
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