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Title: Sintered silver joints via controlled topography of electronic packaging subcomponents

Abstract

Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.

Inventors:
Issue Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1154940
Patent Number(s):
8,822,036
Application Number:
13/787,366
Assignee:
UT-Battelle, LLC (Oak Ridge, TN)
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Wereszczak, Andrew A. Sintered silver joints via controlled topography of electronic packaging subcomponents. United States: N. p., 2014. Web.
Wereszczak, Andrew A. Sintered silver joints via controlled topography of electronic packaging subcomponents. United States.
Wereszczak, Andrew A. Tue . "Sintered silver joints via controlled topography of electronic packaging subcomponents". United States. https://www.osti.gov/servlets/purl/1154940.
@article{osti_1154940,
title = {Sintered silver joints via controlled topography of electronic packaging subcomponents},
author = {Wereszczak, Andrew A.},
abstractNote = {Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {9}
}

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Works referenced in this record:

Size-Scaling of Tensile Failure Stress in a Hot-Pressed Silicon Carbide: Size-Scaling of Tensile Failure Stress in Silicon Carbide
journal, April 2010

  • Wereszczak, Andrew A.; Kirkland, Timothy P.; Strong, Kevin T.
  • International Journal of Applied Ceramic Technology, Vol. 7, Issue 5
  • DOI: 10.1111/j.1744-7402.2010.02517.x