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Title: Environmentally-assisted technique for transferring devices onto non-conventional substrates

A device fabrication method includes: (1) providing a growth substrate including a base and an oxide layer disposed over the base; (2) forming a metal layer over the oxide layer; (3) forming a stack of device layers over the metal layer; (4) performing interfacial debonding of the metal layer to separate the stack of device layers and the metal layer from the growth substrate; and (5) affixing the stack of device layers to a target substrate.
Inventors:
; ;
Issue Date:
OSTI Identifier:
1151764
Assignee:
Board of Trustees of the Leland Stanford Junior University (Palo Alto, CA) CHO
Patent Number(s):
8,815,707
Application Number:
13/791,214
Contract Number:
SC0001060
Research Org:
Leland Stanford Junior University, Palo Alto, CA (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Other works cited in this record:

Stretchable and Foldable Silicon Integrated Circuits
journal, April 2008

Ultrathin silicon solar microcells for semitransparent, mechanically flexible and microconcentrator module designs
journal, October 2008
  • Yoon, Jongseung; Baca, Alfred J.; Park, Sang-Il
  • Nature Materials, Vol. 7, Issue 11, p. 907-915
  • DOI: 10.1038/nmat2287

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