Method of forming an HTS article
Abstract
A method of forming a superconducting article includes providing a substrate tape, forming a superconducting layer overlying the substrate tape, and depositing a capping layer overlying the superconducting layer. The capping layer includes a noble metal and has a thickness not greater than about 1.0 micron. The method further includes electrodepositing a stabilizer layer overlying the capping layer using a solution that is non-reactive to the superconducting layer. The superconducting layer has an as-formed critical current I.sub.C(AF) and a post-stabilized critical current I.sub.C(PS). The I.sub.C(PS) is at least about 95% of the I.sub.C(AF).
- Inventors:
- Issue Date:
- Research Org.:
- National Renewable Energy Lab. (NREL), Golden, CO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1150644
- Patent Number(s):
- 8,809,237
- Application Number:
- 12/033,660
- Assignee:
- SuperPower, Inc. (Schenectady, NY)
- DOE Contract Number:
- AC36-99GO10337
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Bhattacharya, Raghu N., Zhang, Xun, and Selvamanickam, Venkat. Method of forming an HTS article. United States: N. p., 2014.
Web.
Bhattacharya, Raghu N., Zhang, Xun, & Selvamanickam, Venkat. Method of forming an HTS article. United States.
Bhattacharya, Raghu N., Zhang, Xun, and Selvamanickam, Venkat. Tue .
"Method of forming an HTS article". United States. https://www.osti.gov/servlets/purl/1150644.
@article{osti_1150644,
title = {Method of forming an HTS article},
author = {Bhattacharya, Raghu N. and Zhang, Xun and Selvamanickam, Venkat},
abstractNote = {A method of forming a superconducting article includes providing a substrate tape, forming a superconducting layer overlying the substrate tape, and depositing a capping layer overlying the superconducting layer. The capping layer includes a noble metal and has a thickness not greater than about 1.0 micron. The method further includes electrodepositing a stabilizer layer overlying the capping layer using a solution that is non-reactive to the superconducting layer. The superconducting layer has an as-formed critical current I.sub.C(AF) and a post-stabilized critical current I.sub.C(PS). The I.sub.C(PS) is at least about 95% of the I.sub.C(AF).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {8}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Electroplating of superconductor elements
patent, November 1995
- Hauser, Ray L.; Zheng, Bolin; Renbarger, Michael
- US Patent Document 5,470,820
Additive enhanced nonaqueous electrodeposition of silver on Ba 2 YCu 3 O 7
journal, August 1990
- Rosamilia, J. M.; Miller, B.
- Journal of Materials Research, Vol. 5, Issue 8