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Title: Enhanced vbasis laser diode package

Abstract

A substrate having an upper surface and a lower surface is provided. The substrate includes a plurality of v-grooves formed in the upper surface. Each v-groove includes a first side and a second side perpendicular to the first side. A laser diode bar assembly is disposed within each of the v-grooves and attached to the first side. The laser diode bar assembly includes a first adhesion layer disposed on the first side of the v-groove, a metal plate attached to the first adhesion layer, a second adhesion layer disposed over the metal plate, and a laser diode bar attached to the second adhesion layer. The laser diode bar has a coefficient of thermal expansion (CTE) substantially similar to that of the metal plate.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1150634
Patent Number(s):
8811445
Application Number:
12/748,724
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Deri, Robert J., Chen, Diana, Bayramian, Andy, Freitas, Barry, and Kotovsky, Jack. Enhanced vbasis laser diode package. United States: N. p., 2014. Web.
Deri, Robert J., Chen, Diana, Bayramian, Andy, Freitas, Barry, & Kotovsky, Jack. Enhanced vbasis laser diode package. United States.
Deri, Robert J., Chen, Diana, Bayramian, Andy, Freitas, Barry, and Kotovsky, Jack. Tue . "Enhanced vbasis laser diode package". United States. https://www.osti.gov/servlets/purl/1150634.
@article{osti_1150634,
title = {Enhanced vbasis laser diode package},
author = {Deri, Robert J. and Chen, Diana and Bayramian, Andy and Freitas, Barry and Kotovsky, Jack},
abstractNote = {A substrate having an upper surface and a lower surface is provided. The substrate includes a plurality of v-grooves formed in the upper surface. Each v-groove includes a first side and a second side perpendicular to the first side. A laser diode bar assembly is disposed within each of the v-grooves and attached to the first side. The laser diode bar assembly includes a first adhesion layer disposed on the first side of the v-groove, a metal plate attached to the first adhesion layer, a second adhesion layer disposed over the metal plate, and a laser diode bar attached to the second adhesion layer. The laser diode bar has a coefficient of thermal expansion (CTE) substantially similar to that of the metal plate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 19 00:00:00 EDT 2014},
month = {Tue Aug 19 00:00:00 EDT 2014}
}

Works referenced in this record:

Semiconductor device
patent, February 1994


Microlens frames for laser diode arrays
patent, July 1999


Silicon-based strain-symmetrized GE-SI quantum lasers
patent, November 2000


Reliability of heat sink mounted laser diode bars
patent, September 2004