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Title: Full tape thickness feature conductors for EMI structures

Abstract

Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.

Inventors:
; ; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1133960
Patent Number(s):
8747591
Application Number:
12/833,262
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Peterson, Kenneth A., Knudson, Richard T., Smith, Frank R., and Barner, Gregory. Full tape thickness feature conductors for EMI structures. United States: N. p., 2014. Web.
Peterson, Kenneth A., Knudson, Richard T., Smith, Frank R., & Barner, Gregory. Full tape thickness feature conductors for EMI structures. United States.
Peterson, Kenneth A., Knudson, Richard T., Smith, Frank R., and Barner, Gregory. Tue . "Full tape thickness feature conductors for EMI structures". United States. https://www.osti.gov/servlets/purl/1133960.
@article{osti_1133960,
title = {Full tape thickness feature conductors for EMI structures},
author = {Peterson, Kenneth A. and Knudson, Richard T. and Smith, Frank R. and Barner, Gregory},
abstractNote = {Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {6}
}