Full tape thickness feature conductors for EMI structures
Abstract
Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1133960
- Patent Number(s):
- 8747591
- Application Number:
- 12/833,262
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B05 - SPRAYING OR ATOMISING IN GENERAL B05D - PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Peterson, Kenneth A., Knudson, Richard T., Smith, Frank R., and Barner, Gregory. Full tape thickness feature conductors for EMI structures. United States: N. p., 2014.
Web.
Peterson, Kenneth A., Knudson, Richard T., Smith, Frank R., & Barner, Gregory. Full tape thickness feature conductors for EMI structures. United States.
Peterson, Kenneth A., Knudson, Richard T., Smith, Frank R., and Barner, Gregory. Tue .
"Full tape thickness feature conductors for EMI structures". United States. https://www.osti.gov/servlets/purl/1133960.
@article{osti_1133960,
title = {Full tape thickness feature conductors for EMI structures},
author = {Peterson, Kenneth A. and Knudson, Richard T. and Smith, Frank R. and Barner, Gregory},
abstractNote = {Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {6}
}
Works referenced in this record:
Electrical circuit using low volume multilayer transmission line devices
patent, June 1995
- Kommrusch, Richard S.; Gu, Wang-Chang Albert
- US Patent Document 5,426,404
Low temperature co-fired ceramic (LTCC) high density interconnect package with circuitry within the cavity walls
patent, October 1995
- Virga, Kathleen L.; Cisco, Terry C.; Owens, Joseph N.
- US Patent Document 5,461,196
Antenna array for sensing signals on conductors
patent, August 1999
- Rainhart, Robert L.; Davis, Larry; Newton, Charles M.
- US Patent Document 5,933,121
Waveguide with edge grounding
patent, June 2000
- Adkins, Calvin L.; Belcher, Donald K.
- US Patent Document 6,072,375
Miniaturized multilayer ceramic filter with high impedance lines connected to parallel coupled lines
patent, September 2000
- Lo, Wen-Teng
- US Patent Document 6,114,925
Image forming apparatus having transfer drum with transfer paper charging member
patent, May 2001
- Abe, Takuya; Toizumi, Kiyoshi; Shimazu, Fumio
- US Patent Document 6,233,422
Inductor device and process of production thereof
patent, March 2002
- Anbo, Toshiyuki; Uchikoba, Fumio
- US Patent Document 6,362,716
Laminated ceramic electronic components and manufacturing method therefor
patent, May 2004
- Tokuda, Hiromichi; Okuyama, Shingo; Tatsukawa, Tsuyoshi
- US Patent Document 6,730,183
Ceramic multilayer substrate and method for manufacturing the same
patent, November 2005
- Jun, Seok Taek; Lee, Young-Keun; Choi, Ik Seo
- US Patent Document 6,965,161
Method for producing a tube
patent, January 2007
- Peterson, Kenneth A.; Rohde, Steven B.; Pfeifer, Kent B.
- US Patent Document 7,155,812
Electronic package with improved current carrying capability and method of forming the same
patent, August 2008
- Natarajan, Govindarajan; Bezama, Raschid J.
- US Patent Document 7,407,883
Method of using sacrificial materials for fabricating internal cavities in laminated dielectric structures
patent, February 2009
- Peterson, Kenneth A.
- US Patent Document 7,494,557
Temperature compensating device with integral sheet thermistors
patent-application, July 2003
- Mazzoxhette, Joseph
- US Patent Application 10/043582; 20030128096
Paste for internal electrode and process for producing electronic part
patent-application, September 2006
- Nakamura, Tomoko
- US Patent Application 10/549515; 20060197062