Full tape thickness feature conductors for EMI structures
Abstract
Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1133960
- Patent Number(s):
- 8747591
- Application Number:
- 12/833,262
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B05 - SPRAYING OR ATOMISING IN GENERAL B05D - PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Peterson, Kenneth A., Knudson, Richard T., Smith, Frank R., and Barner, Gregory. Full tape thickness feature conductors for EMI structures. United States: N. p., 2014.
Web.
Peterson, Kenneth A., Knudson, Richard T., Smith, Frank R., & Barner, Gregory. Full tape thickness feature conductors for EMI structures. United States.
Peterson, Kenneth A., Knudson, Richard T., Smith, Frank R., and Barner, Gregory. Tue .
"Full tape thickness feature conductors for EMI structures". United States. https://www.osti.gov/servlets/purl/1133960.
@article{osti_1133960,
title = {Full tape thickness feature conductors for EMI structures},
author = {Peterson, Kenneth A. and Knudson, Richard T. and Smith, Frank R. and Barner, Gregory},
abstractNote = {Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {6}
}
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