Suppressing tin whisker growth in lead-free solders and platings
Abstract
A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Savannah River Site (SRS), Aiken, SC (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1130083
- Patent Number(s):
- 8709179
- Application Number:
- 13/269,803
- Assignee:
- Savannah River Nuclear Solutions, LLC (Aiken, SC)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
C - CHEMISTRY C22 - METALLURGY C22F - CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- DOE Contract Number:
- AC09-08SR22470
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2011 Oct 10
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Hoffman, Elizabeth N, and Lam, Poh-Sang. Suppressing tin whisker growth in lead-free solders and platings. United States: N. p., 2014.
Web.
Hoffman, Elizabeth N, & Lam, Poh-Sang. Suppressing tin whisker growth in lead-free solders and platings. United States.
Hoffman, Elizabeth N, and Lam, Poh-Sang. Tue .
"Suppressing tin whisker growth in lead-free solders and platings". United States. https://www.osti.gov/servlets/purl/1130083.
@article{osti_1130083,
title = {Suppressing tin whisker growth in lead-free solders and platings},
author = {Hoffman, Elizabeth N and Lam, Poh-Sang},
abstractNote = {A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 29 00:00:00 EDT 2014},
month = {Tue Apr 29 00:00:00 EDT 2014}
}
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Works referenced in this record:
Minimizing whisker growth in tin electrodeposits
patent-application, July 2005
- Schetty, III, Robert A.; Vickers, Winnie
- US Patent Application 10/973706; 20050145502
Prevention of Sn whisker growth for high reliability electronic devices
patent-application, May 2007
- Tu, King-Ning
- US Patent Application 11/285312; 20070117475
Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits
journal, November 2005
- Boettinger, W. J.; Johnson, C. E.; Bendersky, L. A.
- Acta Materialia, Vol. 53, Issue 19, p. 5033-5050
Spontaneous whisker growth on lead-free solder finishes
journal, November 2005
- Tu, K. N.; Li, J. C. M.
- Materials Science and Engineering: A, Vol. 409, Issue 1-2, p. 131-139