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Title: Suppressing tin whisker growth in lead-free solders and platings

A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.
Inventors:
;
Issue Date:
OSTI Identifier:
1130083
Assignee:
Savannah River Nuclear Solutions, LLC (Aiken, SC) SRNL
Patent Number(s):
8,709,179
Application Number:
13/269,803
Contract Number:
AC09-08SR22470
Resource Relation:
Patent File Date: 2011 Oct 10
Research Org:
Savannah River Site (SRS), Aiken, SC (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Other works cited in this record:

Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits
journal, November 2005

Spontaneous whisker growth on lead-free solder finishes
journal, November 2005

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