Method of fabricating a cooled electronic system
Abstract
A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1119677
- Patent Number(s):
- 8649177
- Application Number:
- 13/451,714
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- DOE Contract Number:
- EE0002894
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, and Steinke, Mark E. Method of fabricating a cooled electronic system. United States: N. p., 2014.
Web.
Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, & Steinke, Mark E. Method of fabricating a cooled electronic system. United States.
Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, and Steinke, Mark E. Tue .
"Method of fabricating a cooled electronic system". United States. https://www.osti.gov/servlets/purl/1119677.
@article{osti_1119677,
title = {Method of fabricating a cooled electronic system},
author = {Chainer, Timothy J and Gaynes, Michael A and Graybill, David P and Iyengar, Madhusudan K and Kamath, Vinod and Kochuparambil, Bejoy J and Schmidt, Roger R and Schultz, Mark D and Simco, Daniel P and Steinke, Mark E},
abstractNote = {A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {2}
}