Method of fabricating a cooled electronic system

Chainer, Timothy J; Gaynes, Michael A; Graybill, David P; Iyengar, Madhusudan K; Kamath, Vinod; Kochuparambil, Bejoy J; Schmidt, Roger R; Schultz, Mark D; Simco, Daniel P; Steinke, Mark E

Advanced Search OptionsAdvanced Search queries use a traditional Term Search. For more info, see our FAQ.

All Fields:

Patent Title:

Abstract:

Assignee:

Inventor(s):

Patent Number:

Patent Classification (CPC):

More Options ...

Title: Method of fabricating a cooled electronic system

Abstract

A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Inventors:: Chainer, Timothy J; Gaynes, Michael A; Graybill, David P; Iyengar, Madhusudan K; Kamath, Vinod; Kochuparambil, Bejoy J; Schmidt, Roger R; Schultz, Mark D; Simco, Daniel P; Steinke, Mark E

Issue Date:: Tue Feb 11 00:00:00 EST 2014

Research Org.:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1119677

Patent Number(s):: 8649177

Application Number:: 13/451,714

Assignee:: International Business Machines Corporation (Armonk, NY)

Patent Classifications (CPCs):: H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

Show more

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K7/20772 - {within server blades for removing heat from heat source}
H05K7/20781 - {within cabinets for removing heat from server blades}
H05K7/2079 - {within rooms for removing heat from cabinets}

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/49002 - Electrical device making

Show less

DOE Contract Number:: EE0002894

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, and Steinke, Mark E. Method of fabricating a cooled electronic system.  United States: N. p., 2014. 
        Web.

Copy to clipboard


                    Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, & Steinke, Mark E. Method of fabricating a cooled electronic system.  United States.

Copy to clipboard


                    Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, and Steinke, Mark E. Tue .  
        "Method of fabricating a cooled electronic system".  United States.  https://www.osti.gov/servlets/purl/1119677.

Copy to clipboard


                    
@article{osti_1119677,

  title        = {Method of fabricating a cooled electronic system},

  author       = {Chainer, Timothy J and Gaynes, Michael A and Graybill, David P and Iyengar, Madhusudan K and Kamath, Vinod and Kochuparambil, Bejoy J and Schmidt, Roger R and Schultz, Mark D and Simco, Daniel P and Steinke, Mark E},

  abstractNote = {A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Feb 11 00:00:00 EST 2014},

  month        = {Tue Feb 11 00:00:00 EST 2014}

}

Copy to clipboard

Patent:

Save / Share:

Export Metadata

Save to My Library

Works referenced in this record:

Cooling plate with internal expandable heat pipe
patent, December 1992

Meyer, IV, George Anthony
US Patent Document 5,168,921
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5168921

Magnetic disk storage system
patent, May 1995

Kimura, Hideyuki; Takahashi, Tsuyoshi; Suzuki, Tomio
US Patent Document 5,414,591
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5414591

Cooling device for hard to access non-coplanar circuit chips
patent, August 1998

Harris, Willard S.; Kemink, Randall G.; McClafferty, William D.
US Patent Document 5,794,454
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5794454

Plate type heat pipe and cooling structure using it
patent, July 2001

Ikeda, Masami; Yamamoto, Masaaki; Sho, Hitoshi
US Patent Document 6,263,959
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6263959

High performance cold plate
patent, June 2002

Mankaruse, Magda; Mankaruse, Nagui
US Patent Document 6,411,512
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6411512

Environmental system for rugged disk drive
patent, August 2002

Pandolfi, Richard
US Patent Document 6,434,000
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6434000

High density, high frequency memory chip modules having thermal management structures
patent, November 2002

Li, Che-Yu; Sly, Thomas L.; Shi, Weimin
US Patent Document 6,480,014
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6480014

Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication
patent, April 2003

Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E.
US Patent Document 6,548,894
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6548894

Thermoelectric-enhanced heat exchanger
patent, May 2003

Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E.
US Patent Document 6,557,354
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6557354

Method and apparatus for combined air and liquid cooling of stacked electronics components
patent, August 2004

Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward F.
US Patent Document 6,775,137
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6775137

Car disk drive unit
patent, August 2005

Hidaka, Kenji; Noto, Hirokazu; Takano, Yasuo
US Patent Document 6,934,118
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6934118

External liquid loop heat exchanger for an electronic system
patent, February 2006

Malone, Christopher G.; Simon, Glenn C.
US Patent Document 7,002,799
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7002799

Memory heat sink
patent, December 2006

Stathakis, D. George
US Patent Document 7,151,668
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7151668

Memory heat-dissipating device
patent, May 2007

Tsai, Tung-Bau
US Patent Document 7,221,569
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7221569

Interleaved memory heat sink
patent, June 2007

Ingalz, Charles J.
US Patent Document 7,233,501
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7233501

Systems for integrated cold plate and heat spreader
patent, September 2007

Crocker, Michael T.; Carter, Daniel P.
US Patent Document 7,273,090
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7273090

Cooling system for electronic devices
patent, October 2007

Cheon, Kioan
US Patent Document 7,286,355
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7286355

Memory module assembly including heat sink attached to integrated circuits by adhesive
patent, April 2008

Ni, Jim Chin-Nan
US Patent Document 7,365,985
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7365985

Support carrier for a disk-drive with integrated heat-sink
patent, June 2008

Feroli, Lawrence J.; Beinor, Jr., Albert F.; King, Jr., Joseph P.
US Patent Document 7,388,749
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7388749

Heat dissipation device
patent, July 2008

Lee, Hsieh-Kun; Xia, Wan-Lin; Li, Tao
US Patent Document 7,395,851
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7395851

Disk array system
patent, October 2008

Matsushima, Hitoshi; Fukuda, Hiroshi
US Patent Document 7,436,663
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7436663

Water-cooling heat dissipator
patent, October 2008

Cheng, Chia-Chun
US Patent Document 7,440,278
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7440278

Video graphics array (VGA) card assembly
patent, October 2008

Peng, Xue-Wen; Chen, Rui-Hua
US Patent Document 7,443,672
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7443672

Method and apparatus for dissipating heat in a computer system
patent, August 2009

Ali, Ihab A.
US Patent Document 7,573,714
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7573714

Flex-based circuit module
patent, September 2009

Cady, James W.; Wilder, James; Roper, David L.
US Patent Document 7,595,550
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7595550

Thermal transfer technique using heat pipes with integral rack rails
patent, December 2009

Konshak, Michael V.; Xu, Guoping; Aneshansley, Nicholas E.
US Patent Document 7,626,820
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7626820

Enhancing the cooling of dual in-line memory modules
patent, March 2010

Eckberg, Eric A.; Holahan, Maurice F.
US Patent Document 7,684,196
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7684196

Contained environmental control system for mobile event data recorder
patent, April 2010

Bushnik, Ted G.; Bisson, Terry A.
US Patent Document 7,703,291
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7703291

Heat sink and a method for manufacturing the same
patent, June 2010

Lai, Chi-Yuan; Zhou, Zhi-Yong; Lai, Cheng-Tien
US Patent Document 7,746,642
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7746642

Heat-dissipating mechanism for use with memory module
patent, September 2010

Chou, Chia-Hsing; Tsai, Chih-Wei; Lu, Chia-Hung
US Patent Document 7,791,881
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7791881

Assembly device and assembly method for a cooling element
patent, September 2010

Legen, Anton; Wood, Steve
US Patent Document 7,796,393
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7796393

Thin multi-chip flex module
patent, September 2010

Clayton, James E.; Fathi, Zakaryae
US Patent Document 7,796,399
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7796399

Non-peripherals processing control module having improved heat dissipating properties
patent, October 2010

Sullivan, Jason A.
US Patent Document 7,817,412
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7817412

System for cooling memory modules
patent, June 2011

Iyengar, Madhusudan K.; Kamath, Vinod; Mahaney, Jr., Howard Victor
US Patent Document 7,969,736
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7969736

Liquid-cooled electronics apparatus and methods of fabrication
patent, September 2011

Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.
US Patent Document 8,027,162
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8027162

Thermal interposer liquid cooling system
patent, September 2012

Alyaser, Monem H.; Rice, Jeremy
US Patent Document 8,274,787
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8274787

Supplemental heating for variable load evaporative cold plates
patent-application, May 2001

Chu, Richard C.; Chrysler, Gregory M.
US Patent Application 09/740456; 20010000880
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20010000880

Clothespin type heat dissipating apparatus for semiconductor module
patent-application, December 2004

Im, Yun-hyeok; Baek, Joong-hyun; Kim, Min-ha
US Patent Application 10/776680; 20040250989
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20040250989

Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
patent-application, March 2005

Chu, Richard C.; Ellsworth, JR., Michael J.; Schmidt, Roger R.
US Patent Application 10/675628; 20050068728
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20050068728

Heat exchanger for memory modules
patent-application, July 2006

Gauche, Paul; McEuen, Shawn
US Patent Application 11/027630; 2006014649
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20060146497

Interposable heat sink for adjacent memory modules
patent-application, October 2006

Foster, SR., Jimmy G.; June, Michael S.; Kamath, Vinod
US Patent Application 11/093445; 20060221578
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20060221578

Liquid DIMM Cooler
patent-application, November 2006

Salmonson, Richard; Robinson, Scott; McCann, Timothy
US Patent Application 11/121975; 20060250772
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20060250772

Cooling systems incorporating heat exchangers and thermoelectric layers
patent-application, February 2007

Kenny, Thomas W.; Munch, Mark; Zhou, Peng
US Patent Application 11/582657; 20070034356
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20070034356

Method and Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure
patent-application, November 2007

Weber, Richard M.; Wyatt, William G.; Rummel, Kerrin A.
US Patent Application 11/381297; 20070263356
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20070263356

Memory Module Assembly Including a Clamp for Mounting Heat Sinks Thereon
patent-application, November 2007

Lai, Chen-Tien; Zhou, Zhi-Yong; Ding, Qiao-Li
US Patent Application 11/308839; 20070263359
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20070263359

Cooling apparatus for electronics
patent-application, March 2008

Strobel, Kurt Richard; Morozov, Igor G.
US Patent Application 11/530348; 20080060791
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080060791

Heat-dissipating assembly structure
patent-application, May 2008

Chen, Chiung Yi
US Patent Application 11/586636; 20080101035
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080101035

Tempreature Control Apparatus for a Hard Disk Drive and a Method of Varying the Temperature of Hard Drive
patent-application, May 2008

Farquhar, David Ronald Bain; Orris, David John
US Patent Application 11/665806; 20080112075
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080112075

Socket Enabled Current Delivery to a Thermoelectric Cooler to Cool and In-Substrate Voltage Regulator
patent-application, July 2008

Gupta, Ashish; Chau, David S.
US Patent Application 11/616794; 20080155990
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080155990

Method and Apparatus for Controlling the Temperature of a Disk Drive During Manufacture
patent-application, October 2008

Farquhar, David R.B.; Hill, Matthew R.; Kay, Alexander S.
US Patent Application 12/065587; 20080239564
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080239564

Efficiently Cool Data Centers And Electronic Enclosures Using Loop Heat Pipes
patent-application, October 2008

Fried, Stephen Samuel
US Patent Application 12/103695; 20080259566
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080259566

Conductive Heat Transport Cooling System and Method for a Multi-Component Electronics System
patent-application, October 2008

Campbell, Levi A.; Chu, Richard C.; Ellsworth, Michael J.
US Patent Application 12/144859; 20080259567
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080259567

Heat Dissipating Apparatus And Water Cooling System Having The Same
patent-application, December 2008

Cheng, Chia-Chun
US Patent Application 11/762843; 20080310105
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080310105

System Having A Heat Transfer Apparatus
patent-application, January 2009

Legen, Anton; Wood, Steve
US Patent Application 11/771575; 20090002951
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20090002951

Heat Transfer System
patent-application, March 2009

Kalms, Sven; Weiss, Christian
US Patent Application 12/201524; 20090080151
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20090080151

Cooler for Spatially Confined Cooling
patent-application, May 2009

Cheon, Peter; Song, AnKuk; Park, JeaSung
US Patent Application 11/937486; 20090120607
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20090120607

Cooling Device for Memory Module
patent-application, July 2009

Meyer, IV, George Anthony; Sun, Chien-Hung; Lee, I-Ying
US Patent Application 12/170598; 20090190304
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20090190304

Memory heat-dissipating mechanism
patent-application, September 2009

Lin, Jui-Nan
US Patent Application 12/073182; 20090219687
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20090219687

Method And Apparatus Of Water Cooling Several Parallel Circuit Cards Each Containing Several Chip Packages
patent-application, November 2009

Cipolla, Thomas M.; Tian, Shurong; Colgan, Evan George
US Patent Application 12/115618; 20090277616
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20090277616

Thermal Transfer Technique Using Heat Pipes With Integral Rack Rails
patent-application, November 2009

Konshak, Michael V.; Xu, Guoping; Aneshansley, Nicholas E.
US Patent Application 12/121303; 20090284924
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20090284924

Apparatus and Method of Direct Water Cooling Several Parallel Circuit Cards Each Containing Several Chip Packages
patent-application, February 2010

Cipolla, Thomas M.; Colgan, Evan George; Coteus, Paul W.
US Patent Application 12/185520; 20100025010
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20100025010

Contact Cooled Electronic Enclosure
patent-application, February 2010

Hughes, Phillip N.; Lipps, Robert J.
US Patent Application 12/535272; 20100027220
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20100027220

Liquid Cooling System
patent-application, April 2010

Hrehor, JR., Robert D.; North, Travis; Bailey, Kevin M.
US Patent Application 12/243990; 20100085712
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20100085712

Electronic Device and Heat Dissipating Module Thereof
patent-application, June 2010

Chang, Chin-Lien; Chou, Ya-Chyi; Lee, Ea-Si
US Patent Application 12/624655; 20100142147
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20100142147

High Performance Dual-In-Line Memory (Dimm) Array Liquid Cooling Assembly And Method
patent-application, October 2010

Cambell, Levi A.; Chu, Richard C.; Ellsworth, JR., Michael J.
US Patent Document 12/418973; 20100252234
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20100252234

Liquid-Cooled Cooling Apparatus, Electronics Rack And Methods Of Fabrication Thereof
patent-application, December 2010

Campbell, Levi A.; Chu, Richard C.; Ellsworth, Michael J.
US Patent Application 12/481824; 20100313590
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20100313590

Liquid-Cooled Electronics Apparatus And Methods Of Fabrication
patent-application, March 2011

Campbell, Levi A.; Chu, Richard C.; Ellsworth, Michael J.
US Patent Application 12/566081; 20110069454
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110069454

Cooling Memory Modules Using Cold Plate Blades Coupled to the Memory Modules via Chips
patent-application, February 2012

Rau, Timothy; Simon, Gienn C.
US Patent Application 13/260066; 20120026670
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20120026670