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Title: Method of fabricating a cooled electronic system

Abstract

A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Inventors:
; ; ; ; ; ; ; ; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1119677
Patent Number(s):
8649177
Application Number:
13/451,714
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
DOE Contract Number:  
EE0002894
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, and Steinke, Mark E. Method of fabricating a cooled electronic system. United States: N. p., 2014. Web.
Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, & Steinke, Mark E. Method of fabricating a cooled electronic system. United States.
Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, and Steinke, Mark E. Tue . "Method of fabricating a cooled electronic system". United States. https://www.osti.gov/servlets/purl/1119677.
@article{osti_1119677,
title = {Method of fabricating a cooled electronic system},
author = {Chainer, Timothy J and Gaynes, Michael A and Graybill, David P and Iyengar, Madhusudan K and Kamath, Vinod and Kochuparambil, Bejoy J and Schmidt, Roger R and Schultz, Mark D and Simco, Daniel P and Steinke, Mark E},
abstractNote = {A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {2}
}

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Works referenced in this record:

Liquid DIMM Cooler
patent-application, November 2006


Liquid Cooling System
patent-application, April 2010