Perforation patterned electrical interconnects
Abstract
This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.
- Inventors:
- Issue Date:
- Research Org.:
- ITN Energy Systems, Inc, Littleton, CO, USA
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1117867
- Patent Number(s):
- 8637996
- Application Number:
- 13/717,364
- Assignee:
- ITN Energy Systems, Inc. (Littleton, CO)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- DOE Contract Number:
- AR0000019
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2012 Dec 17
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Frey, Jonathan. Perforation patterned electrical interconnects. United States: N. p., 2014.
Web.
Frey, Jonathan. Perforation patterned electrical interconnects. United States.
Frey, Jonathan. Tue .
"Perforation patterned electrical interconnects". United States. https://www.osti.gov/servlets/purl/1117867.
@article{osti_1117867,
title = {Perforation patterned electrical interconnects},
author = {Frey, Jonathan},
abstractNote = {This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {1}
}
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