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Title: Perforation patterned electrical interconnects

Abstract

This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.

Inventors:
Issue Date:
Research Org.:
ITN Energy Systems, Inc, Littleton, CO, USA
Sponsoring Org.:
USDOE
OSTI Identifier:
1117867
Patent Number(s):
8,637,996
Application Number:
13/717,364
Assignee:
ITN Energy Systems, Inc. (Littleton, CO)
DOE Contract Number:  
AR0000019
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Dec 17
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Frey, Jonathan. Perforation patterned electrical interconnects. United States: N. p., 2014. Web.
Frey, Jonathan. Perforation patterned electrical interconnects. United States.
Frey, Jonathan. Tue . "Perforation patterned electrical interconnects". United States. https://www.osti.gov/servlets/purl/1117867.
@article{osti_1117867,
title = {Perforation patterned electrical interconnects},
author = {Frey, Jonathan},
abstractNote = {This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {1}
}

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