Perforation patterned electrical interconnects

Frey, Jonathan

Title: Perforation patterned electrical interconnects

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Abstract

This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.

Inventors:: Frey, Jonathan

Issue Date:: 2014-01-28

Research Org.:: ITN Energy Systems, Inc, Littleton, CO, USA

Sponsoring Org.:: USDOE

OSTI Identifier:: 1117867

Patent Number(s):: 8637996

Application Number:: 13/717,364

Assignee:: ITN Energy Systems, Inc. (Littleton, CO)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L31/02008 - {for solar cells or solar cell modules}

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
Y02E10/50 - Photovoltaic [PV] energy

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L23/481 - {Internal lead connections, e.g. via connections, feedthrough structures}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L23/5226 - {Via connections in a multilevel interconnection structure}

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DOE Contract Number:: AR0000019

Resource Type:: Patent

Resource Relation:: Patent File Date: 2012 Dec 17

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Frey, Jonathan. Perforation patterned electrical interconnects.  United States: N. p., 2014. 
        Web.

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                    Frey, Jonathan. Perforation patterned electrical interconnects.  United States.

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                    Frey, Jonathan. Tue .  
        "Perforation patterned electrical interconnects".  United States.  https://www.osti.gov/servlets/purl/1117867.

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@article{osti_1117867,

  title        = {Perforation patterned electrical interconnects},

  author       = {Frey, Jonathan},

  abstractNote = {This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2014},

  month        = {1}

}

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