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Title: Metal deposition using seed layers

Abstract

Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.

Inventors:
; ; ; ; ;
Issue Date:
Research Org.:
Massachusetts Institute of Technology (Cambridge, MA)
Sponsoring Org.:
USDOE
OSTI Identifier:
1108012
Patent Number(s):
8,580,100
Application Number:
12/932,372
Assignee:
Massachusetts Institute of Technology (Cambridge, MA); The Trustees of Boston College (Chestnutt Hill, MA); GMZ Energy, Inc. (Waltham, MA)
DOE Contract Number:  
FG02-08ER46516
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Feng, Hsein-Ping, Chen, Gang, Bo, Yu, Ren, Zhifeng, Chen, Shuo, and Poudel, Bed. Metal deposition using seed layers. United States: N. p., 2013. Web.
Feng, Hsein-Ping, Chen, Gang, Bo, Yu, Ren, Zhifeng, Chen, Shuo, & Poudel, Bed. Metal deposition using seed layers. United States.
Feng, Hsein-Ping, Chen, Gang, Bo, Yu, Ren, Zhifeng, Chen, Shuo, and Poudel, Bed. Tue . "Metal deposition using seed layers". United States. https://www.osti.gov/servlets/purl/1108012.
@article{osti_1108012,
title = {Metal deposition using seed layers},
author = {Feng, Hsein-Ping and Chen, Gang and Bo, Yu and Ren, Zhifeng and Chen, Shuo and Poudel, Bed},
abstractNote = {Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {11}
}

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