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Title: Very low pressure high power impulse triggered magnetron sputtering

Abstract

A method and apparatus are described for very low pressure high powered magnetron sputtering of a coating onto a substrate. By the method of this invention, both substrate and coating target material are placed into an evacuable chamber, and the chamber pumped to vacuum. Thereafter a series of high impulse voltage pulses are applied to the target. Nearly simultaneously with each pulse, in one embodiment, a small cathodic arc source of the same material as the target is pulsed, triggering a plasma plume proximate to the surface of the target to thereby initiate the magnetron sputtering process. In another embodiment the plasma plume is generated using a pulsed laser aimed to strike an ablation target material positioned near the magnetron target surface.

Inventors:
;
Issue Date:
Research Org.:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1107788
Patent Number(s):
8568572
Application Number:
12/797,829
Assignee:
The Regents of the University of California (Oakland, CA)
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
DOE Contract Number:  
AC03-76SF00098; AC02-05CH11231
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION

Citation Formats

Anders, Andre, and Andersson, Joakim. Very low pressure high power impulse triggered magnetron sputtering. United States: N. p., 2013. Web.
Anders, Andre, & Andersson, Joakim. Very low pressure high power impulse triggered magnetron sputtering. United States.
Anders, Andre, and Andersson, Joakim. Tue . "Very low pressure high power impulse triggered magnetron sputtering". United States. https://www.osti.gov/servlets/purl/1107788.
@article{osti_1107788,
title = {Very low pressure high power impulse triggered magnetron sputtering},
author = {Anders, Andre and Andersson, Joakim},
abstractNote = {A method and apparatus are described for very low pressure high powered magnetron sputtering of a coating onto a substrate. By the method of this invention, both substrate and coating target material are placed into an evacuable chamber, and the chamber pumped to vacuum. Thereafter a series of high impulse voltage pulses are applied to the target. Nearly simultaneously with each pulse, in one embodiment, a small cathodic arc source of the same material as the target is pulsed, triggering a plasma plume proximate to the surface of the target to thereby initiate the magnetron sputtering process. In another embodiment the plasma plume is generated using a pulsed laser aimed to strike an ablation target material positioned near the magnetron target surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {10}
}

Works referenced in this record:

Influence of high power densities on the composition of pulsed magnetron plasmas
journal, April 2002


Approaches to rid cathodic arc plasmas of macro- and nanoparticles: a review
journal, November 1999


Self-Sputtering Far above the Runaway Threshold: An Extraordinary Metal-Ion Generator
journal, January 2009


Fundamentals of pulsed plasmas for materials processing
journal, May 2004


Efficient, compact power supply for repetitively pulsed, “triggerless” cathodic arcs
journal, December 1999


Plasma “anti-assistance” and “self-assistance” to high power impulse magnetron sputtering
journal, April 2009


Physical vapor deposition dual coating process
patent, August 1993


Plasma-based debris mitigation for extreme ultraviolet (EUV) light source
patent, June 2007


Streaming metal plasma generation by vacuum arc plasma guns
journal, February 1998


Hard laminated film, method of manufacturing the same and film-forming device
patent, August 2007