Very low pressure high power impulse triggered magnetron sputtering
Abstract
A method and apparatus are described for very low pressure high powered magnetron sputtering of a coating onto a substrate. By the method of this invention, both substrate and coating target material are placed into an evacuable chamber, and the chamber pumped to vacuum. Thereafter a series of high impulse voltage pulses are applied to the target. Nearly simultaneously with each pulse, in one embodiment, a small cathodic arc source of the same material as the target is pulsed, triggering a plasma plume proximate to the surface of the target to thereby initiate the magnetron sputtering process. In another embodiment the plasma plume is generated using a pulsed laser aimed to strike an ablation target material positioned near the magnetron target surface.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1107788
- Patent Number(s):
- 8568572
- Application Number:
- 12/797,829
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- DOE Contract Number:
- AC03-76SF00098; AC02-05CH11231
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 47 OTHER INSTRUMENTATION
Citation Formats
Anders, Andre, and Andersson, Joakim. Very low pressure high power impulse triggered magnetron sputtering. United States: N. p., 2013.
Web.
Anders, Andre, & Andersson, Joakim. Very low pressure high power impulse triggered magnetron sputtering. United States.
Anders, Andre, and Andersson, Joakim. Tue .
"Very low pressure high power impulse triggered magnetron sputtering". United States. https://www.osti.gov/servlets/purl/1107788.
@article{osti_1107788,
title = {Very low pressure high power impulse triggered magnetron sputtering},
author = {Anders, Andre and Andersson, Joakim},
abstractNote = {A method and apparatus are described for very low pressure high powered magnetron sputtering of a coating onto a substrate. By the method of this invention, both substrate and coating target material are placed into an evacuable chamber, and the chamber pumped to vacuum. Thereafter a series of high impulse voltage pulses are applied to the target. Nearly simultaneously with each pulse, in one embodiment, a small cathodic arc source of the same material as the target is pulsed, triggering a plasma plume proximate to the surface of the target to thereby initiate the magnetron sputtering process. In another embodiment the plasma plume is generated using a pulsed laser aimed to strike an ablation target material positioned near the magnetron target surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {10}
}
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Works referenced in this record:
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