Mechanically-reattachable liquid-cooled cooling apparatus

Arney, Susanne; Cheng, Jen-Hau; Kolodner, Paul R; Kota-Venkata, Krishna-Murty; Scofield, William; Salamon, Todd R; Simon, Maria E

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A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
A23 - foods or foodstuffs
A24 - tobacco
A41 - wearing apparel
A42 - headwear
A43 - footwear
A44 - haberdashery
A45 - hand or travelling articles
A46 - brushware
A47 - furniture
A61 - medical or veterinary science
A62 - life-saving
A63 - sports
A99 - subject matter not otherwise provided for in this section
B - performing operations
B01 - physical or chemical processes or apparatus in general
B02 - crushing, pulverising, or disintegrating
B03 - separation of solid materials using liquids or using pneumatic tables or jigs
B04 - centrifugal apparatus or machines for carrying-out physical or chemical processes
B05 - spraying or atomising in general
B06 - generating or transmitting mechanical vibrations in general
B07 - separating solids from solids
B08 - cleaning
B09 - disposal of solid waste
B21 - mechanical metal-working without essentially removing material
B22 - casting
B23 - machine tools
B24 - grinding
B25 - hand tools
B26 - hand cutting tools
B27 - working or preserving wood or similar material
B28 - working cement, clay, or stone
B29 - working of plastics
B30 - presses
B31 - making articles of paper, cardboard or material worked in a manner analogous to paper
B32 - layered products
B33 - additive manufacturing technology
B41 - printing
B42 - bookbinding
B43 - writing or drawing implements
B44 - decorative arts
B60 - vehicles in general
B61 - railways
B62 - land vehicles for travelling otherwise than on rails
B63 - ships or other waterborne vessels
B64 - aircraft
B65 - conveying
B66 - hoisting
B67 - opening, closing {or cleaning} bottles, jars or similar containers
B68 - saddlery
B81 - microstructural technology
B82 - nanotechnology
B99 - subject matter not otherwise provided for in this section
C - chemistry
C01 - inorganic chemistry
C02 - treatment of water, waste water, sewage, or sludge
C03 - glass
C04 - cements
C05 - fertilisers
C06 - explosives
C07 - organic chemistry
C08 - organic macromolecular compounds
C09 - dyes
C10 - petroleum, gas or coke industries
C11 - animal or vegetable oils, fats, fatty substances or waxes
C12 - biochemistry
C13 - sugar industry
C14 - skins
C21 - metallurgy of iron
C22 - metallurgy
C23 - coating metallic material
C25 - electrolytic or electrophoretic processes
C30 - crystal growth
C40 - combinatorial technology
C99 - subject matter not otherwise provided for in this section
D - textiles
D01 - natural or man-made threads or fibres
D02 - yarns
D03 - weaving
D04 - braiding
D05 - sewing
D06 - treatment of textiles or the like
D07 - ropes
D10 - indexing scheme associated with sublasses of section d, relating to textiles
D21 - paper-making
D99 - subject matter not otherwise provided for in this section
E - fixed constructions
E01 - construction of roads, railways, or bridges
E02 - hydraulic engineering
E03 - water supply
E04 - building
E05 - locks
E06 - doors, windows, shutters, or roller blinds in general
E21 - earth drilling
E99 - subject matter not otherwise provided for in this section
F - mechanical engineering
F01 - machines or engines in general
F02 - combustion engines
F03 - machines or engines for liquids
F04 - positive - displacement machines for liquids
F05 - indexing schemes relating to engines or pumps in various subclasses of classes f01-f04
F15 - fluid-pressure actuators
F16 - engineering elements and units
F17 - storing or distributing gases or liquids
F21 - lighting
F22 - steam generation
F23 - combustion apparatus
F24 - heating
F25 - refrigeration or cooling
F26 - drying
F27 - furnaces
F28 - heat exchange in general
F41 - weapons
F42 - ammunition
F99 - subject matter not otherwise provided for in this section
G - physics
G01 - measuring
G02 - optics
G03 - photography
G04 - horology
G05 - controlling
G06 - computing
G07 - checking-devices
G08 - signalling
G09 - education
G10 - musical instruments
G11 - information storage
G12 - instrument details
G16 - information and communication technology [ict] specially adapted for specific application fields
G21 - nuclear physics
G99 - subject matter not otherwise provided for in this section
H - electricity
H01 - basic electric elements
H02 - generation
H03 - basic electronic circuitry
H04 - electric communication technique
H05 - electric techniques not otherwise provided for
H99 - subject matter not otherwise provided for in this section
Y - new / cross sectional technologies
Y02 - technologies or applications for mitigation or adaptation against climate change
Y04 - information or communication technologies having an impact on other technology areas
Y10 - technical subjects covered by former uspc

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Title: Mechanically-reattachable liquid-cooled cooling apparatus

Abstract

An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

Inventors:: Arney, Susanne; Cheng, Jen-Hau; Kolodner, Paul R; Kota-Venkata, Krishna-Murty; Scofield, William; Salamon, Todd R; Simon, Maria E

Issue Date:: 2013-09-24

Research Org.:: Alcatel Lucent (Paris, FR)

Sponsoring Org.:: USDOE Office of Energy Efficiency and Renewable Energy (EERE)

OSTI Identifier:: 1096005

Patent Number(s):: 8542489

Application Number:: 13/101,509

Assignee:: Alcatel Lucent (Paris, FR)

Patent Classifications (CPCs):: H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

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H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K7/20645 - {within cabinets for removing heat from sub-racks}
H05K7/20672 - {within sub-racks for removing heat from electronic boards}

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/4973 - Replacing of defective part
Y10T29/49826 - Assembling or joining

Show less

DOE Contract Number:: EE0002895

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Arney, Susanne, Cheng, Jen-Hau, Kolodner, Paul R, Kota-Venkata, Krishna-Murty, Scofield, William, Salamon, Todd R, and Simon, Maria E. Mechanically-reattachable liquid-cooled cooling apparatus.  United States: N. p., 2013. 
        Web.

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                    Arney, Susanne, Cheng, Jen-Hau, Kolodner, Paul R, Kota-Venkata, Krishna-Murty, Scofield, William, Salamon, Todd R, & Simon, Maria E. Mechanically-reattachable liquid-cooled cooling apparatus.  United States.

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                    Arney, Susanne, Cheng, Jen-Hau, Kolodner, Paul R, Kota-Venkata, Krishna-Murty, Scofield, William, Salamon, Todd R, and Simon, Maria E. Tue .  
        "Mechanically-reattachable liquid-cooled cooling apparatus".  United States.  https://www.osti.gov/servlets/purl/1096005.

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@article{osti_1096005,

  title        = {Mechanically-reattachable liquid-cooled cooling apparatus},

  author       = {Arney, Susanne and Cheng, Jen-Hau and Kolodner, Paul R and Kota-Venkata, Krishna-Murty and Scofield, William and Salamon, Todd R and Simon, Maria E},

  abstractNote = {An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2013},

  month        = {9}

}

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Works referenced in this record:

Thermal energy transfer device
patent, November 2010

Basavanhally, Nagesh R.; Hodes, Marc Scott; Kolodner, Paul Robert
US Patent Document 7,832,462
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7832462

Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
patent, November 2003

Faneuf, Barrett M.; De Lorenzo, David S.
US Patent Document 6,643,132
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6643132

Heat-pipe cooled electronic circuit card
patent, December 1982

Lijoi, Bruno; Cirrito, Vincent; Edelstein, Fred
US Patent Document 4,366,526
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4366526

Cooling structure for disk storage device
patent, August 2005

Fukuda, Hiroshi; Fujita, Kenji
US Patent Document 6,927,980
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6927980

Single or dual buss thermal transfer system
patent, September 2004

Bear, Daniel B.
US Patent Document 6,796,372
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6796372

Heat dissipation structure of electronic device
patent, November 2012

Wu, Hsi-Sheng; Chiang, Hsu-Cheng; Hung, Kuo-Shu
US Patent Document 8,305,754
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8305754

Rear roller assembly for a rolloff hoist
patent, January 2004

O'Daniel, Harold W.
US Patent Document 6,676,221
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6676221

Cell thermal connector
patent, December 2004

Belady, Christian L.; Womack, Christopher
US Patent Document 6,829,142
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6829142

Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
patent, July 2011

Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.
US Patent Document 7,978,472
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7978472

Electronic device having a plug-in unit with a heat sink structure
patent, August 1999

Oyamada, Takashi
US Patent Document 5,946,191
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5946191

Modular cooling system and thermal bus for high power electronics cabinets
patent, December 2004

Memory, Stephen; Ganaway, Fredrick E.; Rogers, C. James
US Patent Document 6,828,675
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6828675

Cooling device and electronic equipment including cooling device
patent, May 2011

Toyoda, Hiroyuki; Idei, Akio; Tsubaki, Shigeyasu
US Patent Document 7,936,560
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7936560

Cooling system
patent, July 1994

Leyssens, Francois Jeanne Charles; Rombouts, Hendrikus M. J.
US Patent Document 5,329,425
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5329425

Field replaceable module with enhanced thermal interface
patent, April 2002

Belady, Christian L.
US Patent Document 6,377,453
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6377453

Thermal docking station for electronics
patent, July 2008

Pflueger, John C.
US Patent Document 7,403,384
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7403384

Electronic device and a thermal connector used therein
patent, November 2010

Hayashi, Tomoo; Nakajima, Tadakatsu; Kondo, Yoshihiro
US Patent Document 7,839,640
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7839640

Heat Transfer Systems for Dissipating Thermal Loads From a Computer Rack
patent-application, December 2007

Gilliland, Don A.; Huettner, Cary M.
US Patent Application 11/424045; 20070291452
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20070291452

Enclosure for telecommunications equipment
patent, October 2001

Hutchison, Randy; Shiffbauer, Robert
US Patent Document 6,310,772
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6310772

Thermal Bus or Junction for the Removal of Heat from Electronic Components
patent-application, September 2009

Hom, James; Brewer, Richard Grant; Choi, Hae-won
US Patent Application 12/381332; 20090225515
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20090225515

Cooling device and electronic apparatus using the same
patent, November 2010

Kondo, Yoshihiro; Idei, Akio; Tsubaki, Shigeyasu
US Patent Document 7,826,217
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7826217

Modular Liquid Cooling of Electronic Components While Preserving Data Center Integrity
patent-application, December 2007

Konshak, Michael V.
US Patent Application 11/426,238; 2007/0297136 Al
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20070297136

High efficiency heat removal system for rack mounted computer equipment
patent, April 2012

Neudorfer, Julius
US Patent Document 8,164,901
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8164901

Electronic apparatus
patent, April 2012

Matsushima, Hitoshi; Nakajima, Tadakatsu; Atarashi, Takayuki
US Patent Document 8,164,902
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8164902

Heat exchange system for blade server systems and method
patent, June 2011

Goettert, Carsten; Huels, Harald; Kraemer, Hans-Guenter
US Patent Document 7,957,144
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7957144

Thermal transfer technique using heat pipes with integral rack rails
patent, December 2009

Konshak, Michael V.; Xu, Guoping; Aneshansley, Nicholas E.
US Patent Document 7,626,820
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7626820

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Similar Records

Title: Mechanically-reattachable liquid-cooled cooling apparatus

Abstract

Citation Formats

Thermal energy transfer device patent, November 2010

Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system patent, November 2003

Heat-pipe cooled electronic circuit card patent, December 1982

Cooling structure for disk storage device patent, August 2005

Single or dual buss thermal transfer system patent, September 2004

Heat dissipation structure of electronic device patent, November 2012

Rear roller assembly for a rolloff hoist patent, January 2004

Cell thermal connector patent, December 2004

Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof patent, July 2011

Electronic device having a plug-in unit with a heat sink structure patent, August 1999

Modular cooling system and thermal bus for high power electronics cabinets patent, December 2004

Cooling device and electronic equipment including cooling device patent, May 2011

Cooling system patent, July 1994

Field replaceable module with enhanced thermal interface patent, April 2002

Thermal docking station for electronics patent, July 2008

Electronic device and a thermal connector used therein patent, November 2010

Heat Transfer Systems for Dissipating Thermal Loads From a Computer Rack patent-application, December 2007

Enclosure for telecommunications equipment patent, October 2001

Thermal Bus or Junction for the Removal of Heat from Electronic Components patent-application, September 2009

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Modular Liquid Cooling of Electronic Components While Preserving Data Center Integrity patent-application, December 2007

High efficiency heat removal system for rack mounted computer equipment patent, April 2012

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Thermal transfer technique using heat pipes with integral rack rails patent, December 2009

Thermal energy transfer device
patent, November 2010

Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
patent, November 2003

Heat-pipe cooled electronic circuit card
patent, December 1982

Cooling structure for disk storage device
patent, August 2005

Single or dual buss thermal transfer system
patent, September 2004

Heat dissipation structure of electronic device
patent, November 2012

Rear roller assembly for a rolloff hoist
patent, January 2004

Cell thermal connector
patent, December 2004

Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
patent, July 2011

Electronic device having a plug-in unit with a heat sink structure
patent, August 1999

Modular cooling system and thermal bus for high power electronics cabinets
patent, December 2004

Cooling device and electronic equipment including cooling device
patent, May 2011

Cooling system
patent, July 1994

Field replaceable module with enhanced thermal interface
patent, April 2002

Thermal docking station for electronics
patent, July 2008

Electronic device and a thermal connector used therein
patent, November 2010

Heat Transfer Systems for Dissipating Thermal Loads From a Computer Rack
patent-application, December 2007

Enclosure for telecommunications equipment
patent, October 2001

Thermal Bus or Junction for the Removal of Heat from Electronic Components
patent-application, September 2009

Cooling device and electronic apparatus using the same
patent, November 2010

Modular Liquid Cooling of Electronic Components While Preserving Data Center Integrity
patent-application, December 2007

High efficiency heat removal system for rack mounted computer equipment
patent, April 2012

Electronic apparatus
patent, April 2012

Heat exchange system for blade server systems and method
patent, June 2011

Thermal transfer technique using heat pipes with integral rack rails
patent, December 2009