Encapsulation methods and dielectric layers for organic electrical devices
Abstract
The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.
- Inventors:
- Issue Date:
- Research Org.:
- SRI International (Menlo Park, CA)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1086738
- Patent Number(s):
- 8476119
- Application Number:
- 13/202,065
- Assignee:
- SRI International (Menlo Park, CA)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08G - MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- DOE Contract Number:
- FC26-06NT42936
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 36 MATERIALS SCIENCE
Citation Formats
Blum, Yigal D, Chu, William Siu-Keung, MacQueen, David Brent, and Shi, Yijan. Encapsulation methods and dielectric layers for organic electrical devices. United States: N. p., 2013.
Web.
Blum, Yigal D, Chu, William Siu-Keung, MacQueen, David Brent, & Shi, Yijan. Encapsulation methods and dielectric layers for organic electrical devices. United States.
Blum, Yigal D, Chu, William Siu-Keung, MacQueen, David Brent, and Shi, Yijan. Tue .
"Encapsulation methods and dielectric layers for organic electrical devices". United States. https://www.osti.gov/servlets/purl/1086738.
@article{osti_1086738,
title = {Encapsulation methods and dielectric layers for organic electrical devices},
author = {Blum, Yigal D and Chu, William Siu-Keung and MacQueen, David Brent and Shi, Yijan},
abstractNote = {The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {7}
}
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