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Title: Encapsulation methods for organic electrical devices

Abstract

The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.

Inventors:
; ; ;
Issue Date:
Research Org.:
National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1084088
Patent Number(s):
8466011
Application Number:
13/202,062
Assignee:
SRI International (Menlo Park, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
FC26-06NT42936
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING

Citation Formats

Blum, Yigal D., Chu, William Siu-Keung, MacQueen, David Brent, and Shi, Yijian. Encapsulation methods for organic electrical devices. United States: N. p., 2013. Web.
Blum, Yigal D., Chu, William Siu-Keung, MacQueen, David Brent, & Shi, Yijian. Encapsulation methods for organic electrical devices. United States.
Blum, Yigal D., Chu, William Siu-Keung, MacQueen, David Brent, and Shi, Yijian. Tue . "Encapsulation methods for organic electrical devices". United States. https://www.osti.gov/servlets/purl/1084088.
@article{osti_1084088,
title = {Encapsulation methods for organic electrical devices},
author = {Blum, Yigal D. and Chu, William Siu-Keung and MacQueen, David Brent and Shi, Yijian},
abstractNote = {The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {6}
}