Encapsulation methods for organic electrical devices
Abstract
The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.
- Inventors:
- Issue Date:
- Research Org.:
- National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1084088
- Patent Number(s):
- 8466011
- Application Number:
- 13/202,062
- Assignee:
- SRI International (Menlo Park, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- FC26-06NT42936
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 42 ENGINEERING
Citation Formats
Blum, Yigal D., Chu, William Siu-Keung, MacQueen, David Brent, and Shi, Yijian. Encapsulation methods for organic electrical devices. United States: N. p., 2013.
Web.
Blum, Yigal D., Chu, William Siu-Keung, MacQueen, David Brent, & Shi, Yijian. Encapsulation methods for organic electrical devices. United States.
Blum, Yigal D., Chu, William Siu-Keung, MacQueen, David Brent, and Shi, Yijian. Tue .
"Encapsulation methods for organic electrical devices". United States. https://www.osti.gov/servlets/purl/1084088.
@article{osti_1084088,
title = {Encapsulation methods for organic electrical devices},
author = {Blum, Yigal D. and Chu, William Siu-Keung and MacQueen, David Brent and Shi, Yijian},
abstractNote = {The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {6}
}
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