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Title: Adhesive flexible barrier film, method of forming same, and organic electronic device including same

An adhesive flexible barrier film comprises a substrate and a barrier layer disposed on the substrate. The barrier layer is formed from a barrier composition comprising an organosilicon compound. The adhesive flexible barrier film also comprises an adhesive layer disposed on the barrier layer and formed from an adhesive composition. A method of forming the adhesive flexible barrier film comprises the steps of disposing the barrier composition on the substrate to form the barrier layer, disposing the adhesive composition on the barrier layer to form the adhesive layer, and curing the barrier layer and the adhesive layer. The adhesive flexible barrier film may be utilized in organic electronic devices.
Inventors:
;
Issue Date:
OSTI Identifier:
1083215
Assignee:
Dow Corning Corporation (Midland, MI) NETL
Patent Number(s):
8,368,218
Application Number:
13/144,395
Contract Number:
FC26-05NT42344
Research Org:
Dow Corning Corporation (Midland, MI)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE