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Title: Flexible barrier film, method of forming same, and organic electronic device including same

A flexible barrier film has a thickness of from greater than zero to less than 5,000 nanometers and a water vapor transmission rate of no more than 1.times.10.sup.-2 g/m.sup.2/day at 22.degree. C. and 47% relative humidity. The flexible barrier film is formed from a composition, which comprises a multi-functional acrylate. The composition further comprises the reaction product of an alkoxy-functional organometallic compound and an alkoxy-functional organosilicon compound. A method of forming the flexible barrier film includes the steps of disposing the composition on a substrate and curing the composition to form the flexible barrier film. The flexible barrier film may be utilized in organic electronic devices.
Inventors:
; ;
Issue Date:
OSTI Identifier:
1083016
Assignee:
Dow Corning Corporation (Midland, MI) NETL
Patent Number(s):
8,405,233
Application Number:
13/144,362
Contract Number:
FC26-05NT42344
Research Org:
NETL (National Energy Technology Laboratory, Pittsburgh, PA, and Morgantown, WV (United States))
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE