Apparatus and method for rapid cooling of large area substrates in vacuum
Abstract
The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.
- Inventors:
- Issue Date:
- Research Org.:
- National Renewable Energy Laboratory (NREL), Golden, CO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1082124
- Patent Number(s):
- 8302554
- Application Number:
- 12/861,391
- Assignee:
- Colorada State University Research Foundation. (Ft. Collins, CO)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C03 - GLASS C03C - CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC36-99GO10337
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Barth, Kurt L., Enzenroth, Robert A., and Sampath, Walajabad S. Apparatus and method for rapid cooling of large area substrates in vacuum. United States: N. p., 2012.
Web.
Barth, Kurt L., Enzenroth, Robert A., & Sampath, Walajabad S. Apparatus and method for rapid cooling of large area substrates in vacuum. United States.
Barth, Kurt L., Enzenroth, Robert A., and Sampath, Walajabad S. Tue .
"Apparatus and method for rapid cooling of large area substrates in vacuum". United States. https://www.osti.gov/servlets/purl/1082124.
@article{osti_1082124,
title = {Apparatus and method for rapid cooling of large area substrates in vacuum},
author = {Barth, Kurt L. and Enzenroth, Robert A. and Sampath, Walajabad S.},
abstractNote = {The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 06 00:00:00 EST 2012},
month = {Tue Nov 06 00:00:00 EST 2012}
}