Non-permeable substrate carrier for electroplating
Abstract
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
- Inventors:
- Issue Date:
- Research Org.:
- SunPower Corporation (San Jose, CA)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1080303
- Patent Number(s):
- 8317987
- Application Number:
- 12/889,219
- Assignee:
- SunPower Corporation (San Jose, CA)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- DOE Contract Number:
- FC36-07GO17043
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Abas, Emmanuel Chua, Chen, Chen-An, Ma, Diana Xiaobing, and Ganti, Kalyana Bhargava. Non-permeable substrate carrier for electroplating. United States: N. p., 2012.
Web.
Abas, Emmanuel Chua, Chen, Chen-An, Ma, Diana Xiaobing, & Ganti, Kalyana Bhargava. Non-permeable substrate carrier for electroplating. United States.
Abas, Emmanuel Chua, Chen, Chen-An, Ma, Diana Xiaobing, and Ganti, Kalyana Bhargava. Tue .
"Non-permeable substrate carrier for electroplating". United States. https://www.osti.gov/servlets/purl/1080303.
@article{osti_1080303,
title = {Non-permeable substrate carrier for electroplating},
author = {Abas, Emmanuel Chua and Chen, Chen-An and Ma, Diana Xiaobing and Ganti, Kalyana Bhargava},
abstractNote = {One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {11}
}
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