Title: Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

Abstract

In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Inventors:

Rogers, John A.; Meitl, Matthew; Sun, Yugang; Ko, Heung Cho; Carlson, Andrew; Choi, Won Mook; Stoykovich, Mark; Jiang, Hanqing; Huang, Yonggang; Nuzzo, Ralph G.; Lee, Keon Jae; Zhu, Zhengtao; Menard, Etienne; Khang, Dahl-Young; Kan, Seong Jun; Ahn, Jong Hyun; Kim, Hoon-sik

Issue Date:

2012-07-10

Research Org.:

Univ. of Illinois at Urbana-Champaign, IL (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1069084

Patent Number(s):

8217381

Application Number:

11/851,182

Assignee:

The Board of Trustees of the University of Illinois (Urbana, IL)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L21/02422 - {Non-crystalline insulating materials, e.g. glass, polymers}
H01L21/02628 - {using solutions}
H01L21/4846 - {Leads on or in insulating or insulated substrates, e.g. metallisation
H01L21/8258 - the substrate being a semiconductor, using a combination of technologies covered by {H01L21/8206, H01L21/8213} , H01L21/822, H01L21/8252, H01L21/8254 or H01L21/8256
H01L23/5387 - {Flexible insulating substrates
H01L27/12 - the substrate being other than a semiconductor body, e.g. an insulating body
H01L29/0657 - {characterised by the shape of the body}
H01L29/72 - Transistor-type devices, i.e. able to continuously respond to applied control signals
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/12041 - LED
H01L2924/13091 - Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K1/0283 - {Stretchable printed circuits}
H05K2201/0133 - Elastomeric or compliant polymer
H05K2201/09045 - Locally raised area or protrusion of insulating substrate
H05K2203/0271 - Mechanical force other than pressure, e.g. shearing or pulling
H05K3/20 - by affixing prefabricated conductor pattern {
H05K3/22 - Secondary treatment of printed circuits {

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

Y10T29/4913 - Assembling to base an electrical component, e.g., capacitor, etc.

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DOE Contract Number:  

FG02-91ER45439

Resource Type:

Patent

Resource Relation:

Patent File Date: 2007 Sep 06

Country of Publication:

United States

Language:

English

Subject:

36 MATERIALS SCIENCE