Sealed substrate carrier for electroplating
Abstract
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
- Inventors:
-
- Fremont, CA
- Issue Date:
- Research Org.:
- SunPower Corporation (San Jose, CA)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1068864
- Patent Number(s):
- 8221600
- Application Number:
- 12/889,228
- Assignee:
- SunPower Corporation (San Jose, CA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS
B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29K - INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- DOE Contract Number:
- FC36-07GO17043
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Ganti, Kalyana Bhargava. Sealed substrate carrier for electroplating. United States: N. p., 2012.
Web.
Ganti, Kalyana Bhargava. Sealed substrate carrier for electroplating. United States.
Ganti, Kalyana Bhargava. Tue .
"Sealed substrate carrier for electroplating". United States. https://www.osti.gov/servlets/purl/1068864.
@article{osti_1068864,
title = {Sealed substrate carrier for electroplating},
author = {Ganti, Kalyana Bhargava},
abstractNote = {One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {7}
}
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