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Title: Glass composition and process for sealing void spaces in electrochemical devices

Abstract

A glass foaming material and method are disclosed for filling void spaces in electrochemical devices. The glass material includes a reagent that foams at a temperature above the softening point of the glass. Expansion of the glass fills void spaces including by-pass and tolerance channels of electrochemical devices. In addition, cassette to cassette seals can also be formed while channels and other void spaces are filled, reducing the number of processing steps needed.

Inventors:
 [1];  [2]
  1. Richland, WA
  2. Kennewick, WA
Issue Date:
Research Org.:
Pacific Northwest National Laboratory (PNNL), Richland, WA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1044071
Patent Number(s):
8166777
Application Number:
12/729,096
Assignee:
Battelle Memorial Institute (Richland, WA)
Patent Classifications (CPCs):
C - CHEMISTRY C03 - GLASS C03C - CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01M - PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
DOE Contract Number:  
AC05-76RL01830
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Meinhardt, Kerry D, and Kirby, Brent W. Glass composition and process for sealing void spaces in electrochemical devices. United States: N. p., 2012. Web.
Meinhardt, Kerry D, & Kirby, Brent W. Glass composition and process for sealing void spaces in electrochemical devices. United States.
Meinhardt, Kerry D, and Kirby, Brent W. Tue . "Glass composition and process for sealing void spaces in electrochemical devices". United States. https://www.osti.gov/servlets/purl/1044071.
@article{osti_1044071,
title = {Glass composition and process for sealing void spaces in electrochemical devices},
author = {Meinhardt, Kerry D and Kirby, Brent W},
abstractNote = {A glass foaming material and method are disclosed for filling void spaces in electrochemical devices. The glass material includes a reagent that foams at a temperature above the softening point of the glass. Expansion of the glass fills void spaces including by-pass and tolerance channels of electrochemical devices. In addition, cassette to cassette seals can also be formed while channels and other void spaces are filled, reducing the number of processing steps needed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {5}
}