Power electronics substrate for direct substrate cooling

Le, Khiet; Ward, Terence G; Mann, Brooks S; Yankoski, Edward P; Smith, Gregory S

Title: Power electronics substrate for direct substrate cooling

Abstract

Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

Inventors:

Le, Khiet ^[1]; Ward, Terence G ^[2]; Mann, Brooks S ^[2]; Yankoski, Edward P ^[3]; Smith, Gregory S ^[4]

Mission Viejo, CA
Redondo Beach, CA
Corona, CA
Woodland Hills, CA

Issue Date:: 2012-05-01

Research Org.:: GM Global Technology Operations LLC (Detroit, MI)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1044060

Patent Number(s):: 8169779

Application Number:: 12/638,683

Assignee:: GM Global Technology Operations LLC (Detroit, MI)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L25/072 - {the devices being arranged next to each other}
H01L23/4735 - {Jet impingement
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S165/908 - Fluid jets

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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DOE Contract Number:: FC26-07NT43123

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Le, Khiet, Ward, Terence G, Mann, Brooks S, Yankoski, Edward P, and Smith, Gregory S. Power electronics substrate for direct substrate cooling.  United States: N. p., 2012. 
        Web.

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                    Le, Khiet, Ward, Terence G, Mann, Brooks S, Yankoski, Edward P, & Smith, Gregory S. Power electronics substrate for direct substrate cooling.  United States.

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                    Le, Khiet, Ward, Terence G, Mann, Brooks S, Yankoski, Edward P, and Smith, Gregory S. Tue .  
        "Power electronics substrate for direct substrate cooling".  United States.  https://www.osti.gov/servlets/purl/1044060.

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@article{osti_1044060,

  title        = {Power electronics substrate for direct substrate cooling},

  author       = {Le, Khiet and Ward, Terence G and Mann, Brooks S and Yankoski, Edward P and Smith, Gregory S},

  abstractNote = {Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2012},

  month        = {5}

}

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Works referenced in this record:

Effects of surface roughness on the average heat transfer of an impinging air jet
journal, January 2000

Beitelmal, Abdlmonem H.; Saad, Michel A.; Patel, Chandrakant D.
International Communications in Heat and Mass Transfer, Vol. 27, Issue 1
https://doi.org/10.1016/S0735-1933(00)00079-8

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Title: Power electronics substrate for direct substrate cooling

Abstract

Citation Formats

Effects of surface roughness on the average heat transfer of an impinging air jet journal, January 2000

Effects of surface roughness on the average heat transfer of an impinging air jet
journal, January 2000