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Title: Power electronics substrate for direct substrate cooling

Abstract

Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

Inventors:
 [1];  [2];  [2];  [3];  [4]
  1. Mission Viejo, CA
  2. Redondo Beach, CA
  3. Corona, CA
  4. Woodland Hills, CA
Issue Date:
Research Org.:
GM Global Technology Operations LLC (Detroit, MI)
Sponsoring Org.:
USDOE
OSTI Identifier:
1044060
Patent Number(s):
8169779
Application Number:
12/638,683
Assignee:
GM Global Technology Operations LLC (Detroit, MI)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
DOE Contract Number:  
FC26-07NT43123
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Le, Khiet, Ward, Terence G, Mann, Brooks S, Yankoski, Edward P, and Smith, Gregory S. Power electronics substrate for direct substrate cooling. United States: N. p., 2012. Web.
Le, Khiet, Ward, Terence G, Mann, Brooks S, Yankoski, Edward P, & Smith, Gregory S. Power electronics substrate for direct substrate cooling. United States.
Le, Khiet, Ward, Terence G, Mann, Brooks S, Yankoski, Edward P, and Smith, Gregory S. Tue . "Power electronics substrate for direct substrate cooling". United States. https://www.osti.gov/servlets/purl/1044060.
@article{osti_1044060,
title = {Power electronics substrate for direct substrate cooling},
author = {Le, Khiet and Ward, Terence G and Mann, Brooks S and Yankoski, Edward P and Smith, Gregory S},
abstractNote = {Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {5}
}

Works referenced in this record:

Effects of surface roughness on the average heat transfer of an impinging air jet
journal, January 2000