Power electronics substrate for direct substrate cooling
Abstract
Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
- Inventors:
-
- Mission Viejo, CA
- Redondo Beach, CA
- Corona, CA
- Woodland Hills, CA
- Issue Date:
- Research Org.:
- GM Global Technology Operations LLC (Detroit, MI)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1044060
- Patent Number(s):
- 8169779
- Application Number:
- 12/638,683
- Assignee:
- GM Global Technology Operations LLC (Detroit, MI)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- DOE Contract Number:
- FC26-07NT43123
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Le, Khiet, Ward, Terence G, Mann, Brooks S, Yankoski, Edward P, and Smith, Gregory S. Power electronics substrate for direct substrate cooling. United States: N. p., 2012.
Web.
Le, Khiet, Ward, Terence G, Mann, Brooks S, Yankoski, Edward P, & Smith, Gregory S. Power electronics substrate for direct substrate cooling. United States.
Le, Khiet, Ward, Terence G, Mann, Brooks S, Yankoski, Edward P, and Smith, Gregory S. Tue .
"Power electronics substrate for direct substrate cooling". United States. https://www.osti.gov/servlets/purl/1044060.
@article{osti_1044060,
title = {Power electronics substrate for direct substrate cooling},
author = {Le, Khiet and Ward, Terence G and Mann, Brooks S and Yankoski, Edward P and Smith, Gregory S},
abstractNote = {Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {5}
}
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Works referenced in this record:
Effects of surface roughness on the average heat transfer of an impinging air jet
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- Beitelmal, Abdlmonem H.; Saad, Michel A.; Patel, Chandrakant D.
- International Communications in Heat and Mass Transfer, Vol. 27, Issue 1