Contact stress sensor
Abstract
A contact stress sensor includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element adjacent to the recessed portion. An electric circuit is connected to the pressure sensitive element. The circuit includes a thermal compensator and a pressure signal circuit element configured to provide a signal upon movement of the pressure sensitive element.
- Inventors:
-
- Oakland, CA
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1037764
- Patent Number(s):
- 8109149
- Application Number:
- 12/274,253
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01L - MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 47 OTHER INSTRUMENTATION
Citation Formats
Kotovsky, Jack. Contact stress sensor. United States: N. p., 2012.
Web.
Kotovsky, Jack. Contact stress sensor. United States.
Kotovsky, Jack. Tue .
"Contact stress sensor". United States. https://www.osti.gov/servlets/purl/1037764.
@article{osti_1037764,
title = {Contact stress sensor},
author = {Kotovsky, Jack},
abstractNote = {A contact stress sensor includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element adjacent to the recessed portion. An electric circuit is connected to the pressure sensitive element. The circuit includes a thermal compensator and a pressure signal circuit element configured to provide a signal upon movement of the pressure sensitive element.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {2}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
A flexible MEMS technology and its first application to shear stress sensor skin
conference, January 1997
- Fukang Jiang, ; Walsh, K.
- Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots
Development of polyimide flexible tactile sensor skin
journal, February 2003
- Engel, Jonathan; Chen, Jack; Liu, Chang
- Journal of Micromechanics and Microengineering, Vol. 13, Issue 3