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Title: Nanoparticle-based etching of silicon surfaces

Abstract

A method (300) of texturing silicon surfaces (116) such to reduce reflectivity of a silicon wafer (110) for use in solar cells. The method (300) includes filling (330, 340) a vessel (122) with a volume of an etching solution (124) so as to cover the silicon surface 116) of a wafer or substrate (112). The etching solution (124) is made up of a catalytic nanomaterial (140) and an oxidant-etchant solution (146). The catalytic nanomaterial (140) may include gold or silver nanoparticles or noble metal nanoparticles, each of which may be a colloidal solution. The oxidant-etchant solution (146) includes an etching agent (142), such as hydrofluoric acid, and an oxidizing agent (144), such as hydrogen peroxide. Etching (350) is performed for a period of time including agitating or stirring the etching solution (124). The etch time may be selected such that the etched silicon surface (116) has a reflectivity of less than about 15 percent such as 1 to 10 percent in a 350 to 1000 nanometer wavelength range.

Inventors:
 [1];  [2];  [3];  [4];  [5];  [6]
  1. Boulder, CO
  2. Denver, CO
  3. Evergreen, CO
  4. Littleton, CO
  5. Atlanta, GA
  6. Golden, CO
Issue Date:
Research Org.:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1034302
Patent Number(s):
8075792
Application Number:
12/053,372
Assignee:
Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
DOE Contract Number:  
AC36-99GO10337
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Branz, Howard, Duda, Anna, Ginley, David S, Yost, Vernon, Meier, Daniel, and Ward, James S. Nanoparticle-based etching of silicon surfaces. United States: N. p., 2011. Web.
Branz, Howard, Duda, Anna, Ginley, David S, Yost, Vernon, Meier, Daniel, & Ward, James S. Nanoparticle-based etching of silicon surfaces. United States.
Branz, Howard, Duda, Anna, Ginley, David S, Yost, Vernon, Meier, Daniel, and Ward, James S. Tue . "Nanoparticle-based etching of silicon surfaces". United States. https://www.osti.gov/servlets/purl/1034302.
@article{osti_1034302,
title = {Nanoparticle-based etching of silicon surfaces},
author = {Branz, Howard and Duda, Anna and Ginley, David S and Yost, Vernon and Meier, Daniel and Ward, James S},
abstractNote = {A method (300) of texturing silicon surfaces (116) such to reduce reflectivity of a silicon wafer (110) for use in solar cells. The method (300) includes filling (330, 340) a vessel (122) with a volume of an etching solution (124) so as to cover the silicon surface 116) of a wafer or substrate (112). The etching solution (124) is made up of a catalytic nanomaterial (140) and an oxidant-etchant solution (146). The catalytic nanomaterial (140) may include gold or silver nanoparticles or noble metal nanoparticles, each of which may be a colloidal solution. The oxidant-etchant solution (146) includes an etching agent (142), such as hydrofluoric acid, and an oxidizing agent (144), such as hydrogen peroxide. Etching (350) is performed for a period of time including agitating or stirring the etching solution (124). The etch time may be selected such that the etched silicon surface (116) has a reflectivity of less than about 15 percent such as 1 to 10 percent in a 350 to 1000 nanometer wavelength range.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 13 00:00:00 EST 2011},
month = {Tue Dec 13 00:00:00 EST 2011}
}

Works referenced in this record:

Black multi-crystalline silicon solar cells
journal, March 2007


Black nonreflecting silicon surfaces for solar cells
journal, May 2006


Metal-assisted chemical etching of silicon in HF–H2O2
journal, July 2008