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Title: Planar controlled zone microwave plasma system

Abstract

An apparatus and method for initiating a process gas plasma. A conductive plate having a plurality of conductive fingers is positioned in a microwave applicator. An arc forms between the conductive fingers to initiate the formation of a plasma. A transport mechanism may convey process materials through the plasma. A spray port may be provided to expel processed materials.

Inventors:
 [1];  [2];  [3]
  1. Knoxville, TN
  2. Oak Ridge, TN
  3. Knoxvlle, TN
Issue Date:
Research Org.:
Oak Ridge Y-12 Plant (Y-12), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1029315
Patent Number(s):
8028654
Application Number:
12/555,459
Assignee:
Babcock & Wilcox Technical Services Y-12, LLC (Oak Ridge, TN)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05H - PLASMA TECHNIQUE
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
DOE Contract Number:  
AC05-00OR22800
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
70 PLASMA PHYSICS AND FUSION TECHNOLOGY

Citation Formats

Ripley, Edward B, Seals, Roland D, and Morrell, Jonathan S. Planar controlled zone microwave plasma system. United States: N. p., 2011. Web.
Ripley, Edward B, Seals, Roland D, & Morrell, Jonathan S. Planar controlled zone microwave plasma system. United States.
Ripley, Edward B, Seals, Roland D, and Morrell, Jonathan S. Tue . "Planar controlled zone microwave plasma system". United States. https://www.osti.gov/servlets/purl/1029315.
@article{osti_1029315,
title = {Planar controlled zone microwave plasma system},
author = {Ripley, Edward B and Seals, Roland D and Morrell, Jonathan S},
abstractNote = {An apparatus and method for initiating a process gas plasma. A conductive plate having a plurality of conductive fingers is positioned in a microwave applicator. An arc forms between the conductive fingers to initiate the formation of a plasma. A transport mechanism may convey process materials through the plasma. A spray port may be provided to expel processed materials.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2011},
month = {10}
}

Patent:

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