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Title: Printable semiconductor structures and related methods of making and assembling

Abstract

The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Inventors:
 [1];  [1];  [2];  [3];  [4];  [5];  [6];  [7];  [4];  [8]
  1. Champaign, IL
  2. Durham, NC
  3. Tokyo, JP
  4. Urbana, IL
  5. Westmont, IL
  6. Raleigh, NC
  7. Rapid City, SD
  8. Goleta, CA
Issue Date:
Research Org.:
Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1028664
Patent Number(s):
8039847
Application Number:
12/844,492
Assignee:
The Board of Trustees of the University of Illinois (Urbana, IL)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
DOE Contract Number:  
FG02-91ER45439
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING

Citation Formats

Nuzzo, Ralph G, Rogers, John A, Menard, Etienne, Lee, Keon Jae, Khang, Dahl-Young, Sun, Yugang, Meitl, Matthew, Zhu, Zhengtao, Ko, Heung Cho, and Mack, Shawn. Printable semiconductor structures and related methods of making and assembling. United States: N. p., 2011. Web.
Nuzzo, Ralph G, Rogers, John A, Menard, Etienne, Lee, Keon Jae, Khang, Dahl-Young, Sun, Yugang, Meitl, Matthew, Zhu, Zhengtao, Ko, Heung Cho, & Mack, Shawn. Printable semiconductor structures and related methods of making and assembling. United States.
Nuzzo, Ralph G, Rogers, John A, Menard, Etienne, Lee, Keon Jae, Khang, Dahl-Young, Sun, Yugang, Meitl, Matthew, Zhu, Zhengtao, Ko, Heung Cho, and Mack, Shawn. Tue . "Printable semiconductor structures and related methods of making and assembling". United States. https://www.osti.gov/servlets/purl/1028664.
@article{osti_1028664,
title = {Printable semiconductor structures and related methods of making and assembling},
author = {Nuzzo, Ralph G and Rogers, John A and Menard, Etienne and Lee, Keon Jae and Khang, Dahl-Young and Sun, Yugang and Meitl, Matthew and Zhu, Zhengtao and Ko, Heung Cho and Mack, Shawn},
abstractNote = {The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2011},
month = {10}
}

Patent:

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