Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom
Abstract
An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.
- Inventors:
-
- Naperville, IL
- Batavia, IL
- Lincolnwood, IL
- Issue Date:
- Research Org.:
- Argonne National Laboratory (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1019427
- Patent Number(s):
- 7977395
- Application Number:
- US Patent Application 12/288,554
- Assignee:
- UChicago Argonne, LLC (Chicago, IL)
- DOE Contract Number:
- W-31-109-ENG-38
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Lin, YuPo J, Henry, Michael P, and Snyder, Seth W. Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom. United States: N. p., 2011.
Web.
Lin, YuPo J, Henry, Michael P, & Snyder, Seth W. Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom. United States.
Lin, YuPo J, Henry, Michael P, and Snyder, Seth W. Tue .
"Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom". United States. https://www.osti.gov/servlets/purl/1019427.
@article{osti_1019427,
title = {Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom},
author = {Lin, YuPo J and Henry, Michael P and Snyder, Seth W},
abstractNote = {An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 12 00:00:00 EDT 2011},
month = {Tue Jul 12 00:00:00 EDT 2011}
}