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Title: Non-destructive component separation using infrared radiant energy

Abstract

A method for separating a first component and a second component from one another at an adhesive bond interface between the first component and second component. Typically the method involves irradiating the first component with infrared radiation from a source that radiates substantially only short wavelengths until the adhesive bond is destabilized, and then separating the first component and the second component from one another. In some embodiments an assembly of components to be debonded is placed inside an enclosure and the assembly is illuminated from an IR source that is external to the enclosure. In some embodiments an assembly of components to be debonded is simultaneously irradiated by a multi-planar array of IR sources. Often the IR radiation is unidirectional. In some embodiments the IR radiation is narrow-band short wavelength infrared radiation.

Inventors:
 [1];  [1];  [1];  [2]
  1. Knoxville, TN
  2. Harriman, TN
Issue Date:
Research Org.:
Babcock & Wilcox Services Y-12, LLC (Oak Ridge, TN)
Sponsoring Org.:
USDOE
OSTI Identifier:
1016560
Patent Number(s):
7,896,053
Application Number:
US Patent Application 11/862,458
Assignee:
Babcock & Wilcox Services Y-12, LLC (Oak Ridge, TN) ORO
DOE Contract Number:  
AC05-00OR22800
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Simandl, Ronald F, Russell, Steven W, Holt, Jerrid S, and Brown, John D. Non-destructive component separation using infrared radiant energy. United States: N. p., 2011. Web.
Simandl, Ronald F, Russell, Steven W, Holt, Jerrid S, & Brown, John D. Non-destructive component separation using infrared radiant energy. United States.
Simandl, Ronald F, Russell, Steven W, Holt, Jerrid S, and Brown, John D. Tue . "Non-destructive component separation using infrared radiant energy". United States. https://www.osti.gov/servlets/purl/1016560.
@article{osti_1016560,
title = {Non-destructive component separation using infrared radiant energy},
author = {Simandl, Ronald F and Russell, Steven W and Holt, Jerrid S and Brown, John D},
abstractNote = {A method for separating a first component and a second component from one another at an adhesive bond interface between the first component and second component. Typically the method involves irradiating the first component with infrared radiation from a source that radiates substantially only short wavelengths until the adhesive bond is destabilized, and then separating the first component and the second component from one another. In some embodiments an assembly of components to be debonded is placed inside an enclosure and the assembly is illuminated from an IR source that is external to the enclosure. In some embodiments an assembly of components to be debonded is simultaneously irradiated by a multi-planar array of IR sources. Often the IR radiation is unidirectional. In some embodiments the IR radiation is narrow-band short wavelength infrared radiation.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2011},
month = {3}
}

Patent:

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