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Title: Encapsulant materials and associated devices

Abstract

Compositions suitable for use as encapsulants are described. The inventive compositions include a high molecular weight polymeric material, a curing agent, an inorganic compound, and a coupling agent. Optional elements include adhesion promoting agents, colorants, antioxidants, and UV absorbers. The compositions have desirable diffusivity properties, making them suitable for use in devices in which a substantial blocking of moisture ingress is desired, such as photovoltaic (PV) modules.

Inventors:
 [1];  [2]
  1. Littleton, CO
  2. Lima, OH
Issue Date:
Research Org.:
BRP Manufacturing Company (Lima, OH); Alliance For Sustainable Energy, LLC (Golden, CO)
Sponsoring Org.:
USDOE
OSTI Identifier:
1016539
Patent Number(s):
7902301
Application Number:
US Patent Application 12/131,211
Assignee:
BRP Manufacturing Company (Lima, OH); Alliance For Sustainable Energy, LLC (Golden, CO)
Patent Classifications (CPCs):
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08L - COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC36-99GO10337
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Kempe, Michael D, and Thapa, Prem. Encapsulant materials and associated devices. United States: N. p., 2011. Web.
Kempe, Michael D, & Thapa, Prem. Encapsulant materials and associated devices. United States.
Kempe, Michael D, and Thapa, Prem. Tue . "Encapsulant materials and associated devices". United States. https://www.osti.gov/servlets/purl/1016539.
@article{osti_1016539,
title = {Encapsulant materials and associated devices},
author = {Kempe, Michael D and Thapa, Prem},
abstractNote = {Compositions suitable for use as encapsulants are described. The inventive compositions include a high molecular weight polymeric material, a curing agent, an inorganic compound, and a coupling agent. Optional elements include adhesion promoting agents, colorants, antioxidants, and UV absorbers. The compositions have desirable diffusivity properties, making them suitable for use in devices in which a substantial blocking of moisture ingress is desired, such as photovoltaic (PV) modules.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2011},
month = {3}
}

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Works referenced in this record:

Moisture transport, adhesion, and corrosion protection of PV module packaging materials
journal, October 2006


Modeling of rates of moisture ingress into photovoltaic modules
journal, October 2006


Acetic acid production and glass transition concerns with ethylene-vinyl acetate used in photovoltaic devices
journal, February 2007