Encapsulant materials and associated devices

Kempe, Michael D; Thapa, Prem

Title: Encapsulant materials and associated devices

Abstract

Compositions suitable for use as encapsulants are described. The inventive compositions include a high molecular weight polymeric material, a curing agent, an inorganic compound, and a coupling agent. Optional elements include adhesion promoting agents, colorants, antioxidants, and UV absorbers. The compositions have desirable diffusivity properties, making them suitable for use in devices in which a substantial blocking of moisture ingress is desired, such as photovoltaic (PV) modules.

Inventors:

Kempe, Michael D ^[1]; Thapa, Prem ^[2]

Littleton, CO
Lima, OH

Issue Date:: 2011-03-08

Research Org.:: BRP Manufacturing Company (Lima, OH); Alliance For Sustainable Energy, LLC (Golden, CO)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1016539

Patent Number(s):: 7902301

Application Number:: US Patent Application 12/131,211

Assignee:: BRP Manufacturing Company (Lima, OH); Alliance For Sustainable Energy, LLC (Golden, CO)

Patent Classifications (CPCs):: C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08L - COMPOSITIONS OF MACROMOLECULAR COMPOUNDS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08L - COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
C08L23/16 - {Elastomeric} ethene-propene or ethene-propene-diene copolymers, {e.g. EPR and EPDM rubbers}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L31/0481 - {characterised by the composition of the encapsulation material}

C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08L - COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
C08L2666/06 - Homopolymers or copolymers of unsaturated hydrocarbons

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
Y02E10/50 - Photovoltaic [PV] energy

C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients
C08K3/013 - Fillers, pigments or reinforcing additives

C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08L - COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
C08L33/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof

C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients
C08K5/14 - Peroxides

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DOE Contract Number:: AC36-99GO10337

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Kempe, Michael D, and Thapa, Prem. Encapsulant materials and associated devices.  United States: N. p., 2011. 
        Web.

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                    Kempe, Michael D, & Thapa, Prem. Encapsulant materials and associated devices.  United States.

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                    Kempe, Michael D, and Thapa, Prem. Tue .  
        "Encapsulant materials and associated devices".  United States.  https://www.osti.gov/servlets/purl/1016539.

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@article{osti_1016539,

  title        = {Encapsulant materials and associated devices},

  author       = {Kempe, Michael D and Thapa, Prem},

  abstractNote = {Compositions suitable for use as encapsulants are described. The inventive compositions include a high molecular weight polymeric material, a curing agent, an inorganic compound, and a coupling agent. Optional elements include adhesion promoting agents, colorants, antioxidants, and UV absorbers. The compositions have desirable diffusivity properties, making them suitable for use in devices in which a substantial blocking of moisture ingress is desired, such as photovoltaic (PV) modules.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2011},

  month        = {3}

}

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Works referenced in this record:

Moisture transport, adhesion, and corrosion protection of PV module packaging materials
journal, October 2006

Jorgensen, G.; Terwilliger, K.; Delcueto, J.
Solar Energy Materials and Solar Cells, Vol. 90, Issue 16
https://doi.org/10.1016/j.solmat.2006.04.003

Modeling of rates of moisture ingress into photovoltaic modules
journal, October 2006

Kempe, Michael D.
Solar Energy Materials and Solar Cells, Vol. 90, Issue 16, p. 2720-2738
https://doi.org/10.1016/j.solmat.2006.04.002

Acetic acid production and glass transition concerns with ethylene-vinyl acetate used in photovoltaic devices
journal, February 2007

Kempe, Michael D.; Jorgensen, Gary J.; Terwilliger, Kent M.
Solar Energy Materials and Solar Cells, Vol. 91, Issue 4
https://doi.org/10.1016/j.solmat.2006.10.009

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Similar Records

Title: Encapsulant materials and associated devices

Abstract

Citation Formats

Moisture transport, adhesion, and corrosion protection of PV module packaging materials journal, October 2006

Modeling of rates of moisture ingress into photovoltaic modules journal, October 2006

Acetic acid production and glass transition concerns with ethylene-vinyl acetate used in photovoltaic devices journal, February 2007

Moisture transport, adhesion, and corrosion protection of PV module packaging materials
journal, October 2006

Modeling of rates of moisture ingress into photovoltaic modules
journal, October 2006

Acetic acid production and glass transition concerns with ethylene-vinyl acetate used in photovoltaic devices
journal, February 2007