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Title: Fabrication of thermal microphotonic sensors and sensor arrays

Abstract

A thermal microphotonic sensor is fabricated on a silicon substrate by etching an opening and a trench into the substrate, and then filling in the opening and trench with silicon oxide which can be deposited or formed by thermally oxidizing a portion of the silicon substrate surrounding the opening and trench. The silicon oxide forms a support post for an optical resonator which is subsequently formed from a layer of silicon nitride, and also forms a base for an optical waveguide formed from the silicon nitride layer. Part of the silicon substrate can be selectively etched away to elevate the waveguide and resonator. The thermal microphotonic sensor, which is useful to detect infrared radiation via a change in the evanescent coupling of light between the waveguide and resonator, can be formed as a single device or as an array.

Inventors:
 [1];  [2];  [2]
  1. (Tijeras, NM)
  2. (Albuquerque, NM)
Issue Date:
Research Org.:
Sandia Corporation (Albuquerque, NM)
Sponsoring Org.:
USDOE
OSTI Identifier:
1015989
Patent Number(s):
7,820,970
Application Number:
12/491,596
Assignee:
Sandia Corporation (Albuquerque, NM) NNSASC
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Shaw, Michael J., Watts, Michael R., and Nielson, Gregory N. Fabrication of thermal microphotonic sensors and sensor arrays. United States: N. p., 2010. Web.
Shaw, Michael J., Watts, Michael R., & Nielson, Gregory N. Fabrication of thermal microphotonic sensors and sensor arrays. United States.
Shaw, Michael J., Watts, Michael R., and Nielson, Gregory N. Tue . "Fabrication of thermal microphotonic sensors and sensor arrays". United States. https://www.osti.gov/servlets/purl/1015989.
@article{osti_1015989,
title = {Fabrication of thermal microphotonic sensors and sensor arrays},
author = {Shaw, Michael J. and Watts, Michael R. and Nielson, Gregory N.},
abstractNote = {A thermal microphotonic sensor is fabricated on a silicon substrate by etching an opening and a trench into the substrate, and then filling in the opening and trench with silicon oxide which can be deposited or formed by thermally oxidizing a portion of the silicon substrate surrounding the opening and trench. The silicon oxide forms a support post for an optical resonator which is subsequently formed from a layer of silicon nitride, and also forms a base for an optical waveguide formed from the silicon nitride layer. Part of the silicon substrate can be selectively etched away to elevate the waveguide and resonator. The thermal microphotonic sensor, which is useful to detect infrared radiation via a change in the evanescent coupling of light between the waveguide and resonator, can be formed as a single device or as an array.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2010},
month = {10}
}

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