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Title: Microsystem process networks

Abstract

Various aspects and applications or microsystem process networks are described. The design of many types of microsystems can be improved by ortho-cascading mass, heat, or other unit process operations. Microsystems having energetically efficient microchannel heat exchangers are also described. Detailed descriptions of numerous design features in microcomponent systems are also provided.

Inventors:
 [1];  [2];  [3]
  1. Richland, WA
  2. Kennewick, WA
  3. West Richland, WA
Issue Date:
Research Org.:
Pacific Northwest National Lab. (PNNL), Richland, WA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1015184
Patent Number(s):
7651669
Application Number:
11/241,585
Assignee:
The United States of America as represented by the United States Department of Energy (Washington, DC)
Patent Classifications (CPCs):
C - CHEMISTRY C01 - INORGANIC CHEMISTRY C01B - NON-METALLIC ELEMENTS
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
DOE Contract Number:  
AC06-76RL01830
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Wegeng, Robert S, TeGrotenhuis, Ward E, and Whyatt, Greg A. Microsystem process networks. United States: N. p., 2010. Web.
Wegeng, Robert S, TeGrotenhuis, Ward E, & Whyatt, Greg A. Microsystem process networks. United States.
Wegeng, Robert S, TeGrotenhuis, Ward E, and Whyatt, Greg A. Tue . "Microsystem process networks". United States. https://www.osti.gov/servlets/purl/1015184.
@article{osti_1015184,
title = {Microsystem process networks},
author = {Wegeng, Robert S and TeGrotenhuis, Ward E and Whyatt, Greg A},
abstractNote = {Various aspects and applications or microsystem process networks are described. The design of many types of microsystems can be improved by ortho-cascading mass, heat, or other unit process operations. Microsystems having energetically efficient microchannel heat exchangers are also described. Detailed descriptions of numerous design features in microcomponent systems are also provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2010},
month = {1}
}

Patent:

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