Direct cooled power electronics substrate

Title: Direct cooled power electronics substrate

Full Record
Other Related Research

Abstract

The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.

Inventors:

Wiles, Randy H ^[1]; Wereszczak, Andrew A ^[2]; Ayers, Curtis W ^[3]; Lowe, Kirk T ^[4]

Powell, TN
Oak Ridge, TN
Kingston, TN
Knoxville, TN

Issue Date:: 2010-09-14

Research Org.:: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1014717

Patent Number(s):: 7,796,388

Application Number:: US Patent Application 12/400,081

Assignee:: UT-Battelle, LLC (Oak Ridge, TN) ORO

DOE Contract Number:: AC05-00OR22725

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Citation Formats


                    Wiles, Randy H, Wereszczak, Andrew A, Ayers, Curtis W, and Lowe, Kirk T. Direct cooled power electronics substrate.  United States: N. p., 2010. 
        Web.

Copy to clipboard


                    Wiles, Randy H, Wereszczak, Andrew A, Ayers, Curtis W, & Lowe, Kirk T. Direct cooled power electronics substrate.  United States.

Copy to clipboard


                    Wiles, Randy H, Wereszczak, Andrew A, Ayers, Curtis W, and Lowe, Kirk T. Tue .  
        "Direct cooled power electronics substrate".  United States.  https://www.osti.gov/servlets/purl/1014717.

Copy to clipboard


                    
@article{osti_1014717,

  title        = {Direct cooled power electronics substrate},

  author       = {Wiles, Randy H and Wereszczak, Andrew A and Ayers, Curtis W and Lowe, Kirk T},

  abstractNote = {The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2010},

  month        = {9}

}

Copy to clipboard

Patent:

View Patent

Save / Share:

Export Metadata

Save to My Library

Similar records in DOE Patents and OSTI.GOV collections:

Power electronics substrate for direct substrate cooling

Patent Le, Khiet [Mission Viejo, CA]; Ward, Terence G [Redondo Beach, CA]; Mann, Brooks S [Redondo Beach, CA]; ...

Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
Full Text Available
Inverter power module with distributed support for direct substrate cooling

Patent Miller, David Harold [San Pedro, CA]; Korich, Mark D [Chino Hills, CA]; Ward, Terence G [Redondo Beach, CA]; ...

Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the firstmore » support frame to form the seal.« less
Full Text Available
Cooled electronic system with thermal spreaders coupling electronics cards to cold rails

Patent Chainer, Timothy J; Gaynes, Michael A; Graybill, David P; ...

Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, whichmore »« less
Full Text Available
Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)

Patent David, Milnes P; Graybill, David P; Iyengar, Madhusudan K; ...

Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking ofmore »« less
Full Text Available
Power electronics cooling apparatus

Patent Sanger, Philip Albert (Monroeville, PA); Lindberg, Frank A. (Baltimore, MD); Garcen, Walter (Glen Burnie, MD)

A semiconductor cooling arrangement wherein a semiconductor is affixed to a thermally and electrically conducting carrier such as by brazing. The coefficient of thermal expansion of the semiconductor and carrier are closely matched to one another so that during operation they will not be overstressed mechanically due to thermal cycling. Electrical connection is made to the semiconductor and carrier, and a porous metal heat exchanger is thermally connected to the carrier. The heat exchanger is positioned within an electrically insulating cooling assembly having cooling oil flowing therethrough. The arrangement is particularly well adapted for the cooling of high power switchingmore » elements in a power bridge.« less
Full Text Available

Similar Records