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Title: Doped LZO buffer layers for laminated conductors

Abstract

A laminated conductor includes a metallic substrate having a surface, a biaxially textured buffer layer supported by the surface of the substrate, the biaxially textured buffer layer comprising LZO and a dopant for mitigating metal diffusion through the LZO, and a biaxially textured conductor layer supported by the biaxially textured buffer layer.

Inventors:
 [1];  [2];  [1];  [2];  [3];  [4]
  1. Knoxville, TN
  2. Westborough, MA
  3. Oxford, MA
  4. Framingham, MA
Issue Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1014465
Patent Number(s):
7683010
Application Number:
U S Patent Application 11/192,487
Assignee:
UT-Battelle, LLC (Oak Ridge, TN)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Paranthaman, Mariappan Parans, Schoop, Urs, Goyal, Amit, Thieme, Cornelis Leo Hans, Verebelyi, Darren T, and Rupich, Martin W. Doped LZO buffer layers for laminated conductors. United States: N. p., 2010. Web.
Paranthaman, Mariappan Parans, Schoop, Urs, Goyal, Amit, Thieme, Cornelis Leo Hans, Verebelyi, Darren T, & Rupich, Martin W. Doped LZO buffer layers for laminated conductors. United States.
Paranthaman, Mariappan Parans, Schoop, Urs, Goyal, Amit, Thieme, Cornelis Leo Hans, Verebelyi, Darren T, and Rupich, Martin W. Tue . "Doped LZO buffer layers for laminated conductors". United States. https://www.osti.gov/servlets/purl/1014465.
@article{osti_1014465,
title = {Doped LZO buffer layers for laminated conductors},
author = {Paranthaman, Mariappan Parans and Schoop, Urs and Goyal, Amit and Thieme, Cornelis Leo Hans and Verebelyi, Darren T and Rupich, Martin W},
abstractNote = {A laminated conductor includes a metallic substrate having a surface, a biaxially textured buffer layer supported by the surface of the substrate, the biaxially textured buffer layer comprising LZO and a dopant for mitigating metal diffusion through the LZO, and a biaxially textured conductor layer supported by the biaxially textured buffer layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2010},
month = {3}
}

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