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Title: Processing a printed wiring board by single bath electrodeposition

Abstract

A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.

Inventors:
 [1];  [2];  [2]
  1. Oakland, CA
  2. Livermore, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1011445
Patent Number(s):
7846317
Application Number:
10/373,350
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Meltzer, Michael P, Steffani, Christopher P, and Gonfiotti, Ray A. Processing a printed wiring board by single bath electrodeposition. United States: N. p., 2010. Web.
Meltzer, Michael P, Steffani, Christopher P, & Gonfiotti, Ray A. Processing a printed wiring board by single bath electrodeposition. United States.
Meltzer, Michael P, Steffani, Christopher P, and Gonfiotti, Ray A. Tue . "Processing a printed wiring board by single bath electrodeposition". United States. https://www.osti.gov/servlets/purl/1011445.
@article{osti_1011445,
title = {Processing a printed wiring board by single bath electrodeposition},
author = {Meltzer, Michael P and Steffani, Christopher P and Gonfiotti, Ray A},
abstractNote = {A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2010},
month = {12}
}

Patent:

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