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Title: Tin-silver-bismuth solders for electronics assembly

A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0
Inventors:
;
Issue Date:
OSTI Identifier:
101003
Assignee:
Sandia Corp., Albuquerque, NM (United States) SNL; SCA: 426000; PA: EDB-95:131445; SN: 95001445748
Patent Number(s):
US 5,439,639/A/
Application Number:
PAN: 8-177,504
Contract Number:
AC04-76DP00789
Resource Relation:
Other Information: PBD: 8 Aug 1995
Research Org:
AT&T Corporation
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; ELECTRONIC CIRCUITS; SOLDERING; BRAZING ALLOYS; CHEMICAL COMPOSITION; TIN ALLOYS; SILVER ALLOYS; BISMUTH ALLOYS