Tin-silver-bismuth solders for electronics assembly

Title: Tin-silver-bismuth solders for electronics assembly

Full Record
Other Related Research

A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0

Inventors:: Vianco, P.T.; Rejent, J.A.

Issue Date:: 1995-08-08

OSTI Identifier:: 101003

Assignee:: Sandia Corp., Albuquerque, NM (United States) SNL; SCA: 426000; PA: EDB-95:131445; SN: 95001445748

Patent Number(s):: US 5,439,639/A/

Application Number:: PAN: 8-177,504

Contract Number:: AC04-76DP00789

Resource Relation:: Other Information: PBD: 8 Aug 1995

Research Org:: AT&T Corporation

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; ELECTRONIC CIRCUITS; SOLDERING; BRAZING ALLOYS; CHEMICAL COMPOSITION; TIN ALLOYS; SILVER ALLOYS; BISMUTH ALLOYS

Full Text
Patents / Patent Applications
Search for the full text at the U.S. Patent and Trademark Office

Have feedback or suggestions for a way to improve these results? !

Save / Share this Record no
Export Metadata
- Endnote
- RIS
- Excel
- CSV
- XML
Send to Email

Send to Email

Email address:

Content:

Similar Records

Similar records in DOepatents and OSTI.GOV collections:

Tin-silver-bismuth solders for electronics assembly

Patent Vianco, Paul T. ; Rejent, Jerome A.

A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0
Full Text Available January 1995
(Use of lead-tin and tin-silver solders for edge clip attachment on polyimide-quartz circuit)

Technical Report - in OSTI.gov collection Not Available

The solder alloys 96.5Sn3.5Ag and 90Pb10Sn were used to attach edge clips to polyimide-quartz circuit boards. An assessment of the solder joints was based upon visual and microscopic examinations as well as shear strength measurements. The boards were evaluated in the as-soldered condition as well as following thermal shock and thermal cycle exposure. The use of these solders has resulted in a reduction of the amount of rework required after this investigation has provided preliminary data applicable towards the general use of high melting point solders on polyimide-quartz boards for elevated temperature applications. The purpose of this investigation was tomore »« less
January 1990
Suppressing tin whisker growth in lead-free solders and platings

Patent Hoffman, Elizabeth N ; Lam, Poh-Sang

A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.
Full Text Available April 2014
A ban on use of lead-bearing solders: Implications for the electronics industry

Technical Report - in OSTI.gov collection Vianco, P.T. ; Yost, F.G.

This white paper addresses the issue of banning lead from solders used in electronics manufacturing. The current efforts by legislative bodies and regulatory agencies to curtail the use of lead in manufactured goods, including solders, are described. In response to a ban on lead or the imposition of a tax which makes lead uneconomical for use in solder alloys, alternative technologies including lead-free solders and conductive epoxies are presented. The recommendation is made that both users and producers of solder materials join together as partners in a consortium to address this issue in a timely and cost-effective manner.
April 1992
Lead-free solders for electronics applications: Wetting analysis

Conference - in OSTI.gov collection Vianco, P.T. ; Hosking, F.M. ; Frear, D.R.

The fabrication of electronic systems has relied upon eutectic tin-lead solder for the attachment of components to printed wiring boards. Higher service temperatures are approaching the durability limits of the eutectic solder. The tin-rich, lead-free solders are being actively studied as alternate alloys. Experiments that examined the wettability of 95Sn-5Sb (wt %), 95.5Sn-4.0Cu-0.5Ag, 96.5Sn-3.5Ag, and the control solder, 60Sn-40Pb, on oxygen-free, high conductivity copper were performed. A rosin-based, mildly activated (RMA) flux and three water soluble, organic acid fluxes were used in the wetting balance/meniscometer measurements. The 95.5Sn-4.0Cu-0.5Ag and 95Sn- 5Sb alloys exhibited good wetting, with contact angles of 35{degree}more »« less
January 1991