Tin-silver-bismuth solders for electronics assembly

Vianco, P T; Rejent, J A

Title: Tin-silver-bismuth solders for electronics assembly

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Abstract

A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218 C down to about 205 C depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10 C/min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight). 4 figs.

Inventors:: Vianco, P T; Rejent, J A

Issue Date:: 1995-08-08

Research Org.:: AT&T

OSTI Identifier:: 101003

Patent Number(s):: 5439639

Application Number:: PAN: 8-177,504

Assignee:: Sandia Corp., Albuquerque, NM (United States)

DOE Contract Number:: AC04-76DP00789

Resource Type:: Patent

Resource Relation:: Other Information: PBD: 8 Aug 1995

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; ELECTRONIC CIRCUITS; SOLDERING; BRAZING ALLOYS; CHEMICAL COMPOSITION; TIN ALLOYS; SILVER ALLOYS; BISMUTH ALLOYS

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                    Vianco, P T, and Rejent, J A. Tin-silver-bismuth solders for electronics assembly.  United States: N. p., 1995. 
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                    Vianco, P T, & Rejent, J A. Tin-silver-bismuth solders for electronics assembly.  United States.

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                    Vianco, P T, and Rejent, J A. Tue .  
        "Tin-silver-bismuth solders for electronics assembly".  United States.

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@article{osti_101003,

  title        = {Tin-silver-bismuth solders for electronics assembly},

  author       = {Vianco, P T and Rejent, J A},

  abstractNote = {A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218 C down to about 205 C depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10 C/min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight). 4 figs.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1995},

  month        = {8}

}

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Tin-silver-bismuth solders for electronics assembly

Patent Vianco, Paul T [Albuquerque, NM]; Rejent, Jerome A [Albuquerque, NM]

A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).
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The solderability of MetGlas^TM (subsidiary of Hitachi Metals, America Ltd) 2826 MB, a rapidly solidified metallic foil, was evaluated by the meniscus height/wetting force method for tin-silver-copper (SnAgCu) and tin-silver-bismuth (SnAgBi) solders to understand the effects of the extreme non-equilibrium condition of the MetglasTM surface on solderability performance. Of the variables studied here (solder temperature, heat treatment, and solder composition), solder composition had the largest impact on contact angle. Flux and foil composition remained constant throughout; but, these factors would also be predicted to significantly affect solderability. A greater understanding of the manner whereby non-equilibrium cooling affects solderability of thesemore »« less
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Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly

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A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.
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Bismuth-based alloys (Bi55.5-Pb44.5 and Bi58-Sn42) were evaluated as potential solder alloys by comparing certain metallurgical properties to Sn63-Pb37. This study shows that the two Bi-alloys are more creep-prone than Sn63. Also, both Bi-alloys are rapidly damaged by thermal cycling. Bi-Pb is a poor alternate solder alloy for high-reliability electronic solder joints. If Bi58-Sn42 is selected, the application should be thoroughly investigated to ensure metallurgical reliability. 4 tabs, figs, 8 refs.

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