Tin-silver-bismuth solders for electronics assembly
Abstract
A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0
- Inventors:
- Issue Date:
- Research Org.:
- AT&T Corporation
- OSTI Identifier:
- 101003
- Patent Number(s):
- 5,439,639
- Application Number:
- PAN: 8-177,504
- Assignee:
- Sandia Corp., Albuquerque, NM (United States)
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Resource Relation:
- Other Information: PBD: 8 Aug 1995
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; ELECTRONIC CIRCUITS; SOLDERING; BRAZING ALLOYS; CHEMICAL COMPOSITION; TIN ALLOYS; SILVER ALLOYS; BISMUTH ALLOYS
Citation Formats
Vianco, P T, and Rejent, J A. Tin-silver-bismuth solders for electronics assembly. United States: N. p., 1995.
Web.
Vianco, P T, & Rejent, J A. Tin-silver-bismuth solders for electronics assembly. United States.
Vianco, P T, and Rejent, J A. Tue .
"Tin-silver-bismuth solders for electronics assembly". United States.
@article{osti_101003,
title = {Tin-silver-bismuth solders for electronics assembly},
author = {Vianco, P T and Rejent, J A},
abstractNote = {A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {8}
}
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