Tin-silver-bismuth solders for electronics assembly

Title: Tin-silver-bismuth solders for electronics assembly

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A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0

Inventors:: Vianco, P.T.; Rejent, J.A.

Issue Date:: 1995-08-08

OSTI Identifier:: 101003

Assignee:: Sandia Corp., Albuquerque, NM (United States) SNL; SCA: 426000; PA: EDB-95:131445; SN: 95001445748

Patent Number(s):: US 5,439,639/A/

Application Number:: PAN: 8-177,504

Contract Number:: AC04-76DP00789

Resource Relation:: Other Information: PBD: 8 Aug 1995

Research Org:: AT&T Corporation

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; ELECTRONIC CIRCUITS; SOLDERING; BRAZING ALLOYS; CHEMICAL COMPOSITION; TIN ALLOYS; SILVER ALLOYS; BISMUTH ALLOYS

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Tin-silver-bismuth solders for electronics assembly

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A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0
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