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Title: Tin-silver-bismuth solders for electronics assembly

Abstract

A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0

Inventors:
;
Issue Date:
Research Org.:
AT&T Corporation
OSTI Identifier:
101003
Patent Number(s):
5,439,639
Application Number:
PAN: 8-177,504
Assignee:
Sandia Corp., Albuquerque, NM (United States)
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 8 Aug 1995
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; ELECTRONIC CIRCUITS; SOLDERING; BRAZING ALLOYS; CHEMICAL COMPOSITION; TIN ALLOYS; SILVER ALLOYS; BISMUTH ALLOYS

Citation Formats

Vianco, P T, and Rejent, J A. Tin-silver-bismuth solders for electronics assembly. United States: N. p., 1995. Web.
Vianco, P T, & Rejent, J A. Tin-silver-bismuth solders for electronics assembly. United States.
Vianco, P T, and Rejent, J A. Tue . "Tin-silver-bismuth solders for electronics assembly". United States.
@article{osti_101003,
title = {Tin-silver-bismuth solders for electronics assembly},
author = {Vianco, P T and Rejent, J A},
abstractNote = {A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {8}
}