Low thermal resistance power module assembly

Hassani, Vahab; Vlahinos, Andreas; Bharathan, Desikan

Title: Low thermal resistance power module assembly

Full Record
Other Related Research

Abstract

A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.

Inventors:

Hassani, Vahab ^[1]; Vlahinos, Andreas ^[2]; Bharathan, Desikan ^[3]

Denver, CO
Castle Rock, CO
Arvada, CO

Issue Date:: 2007-03-13

Research Org.:: National Renewable Energy Lab. (NREL), Golden, CO (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1007934

Patent Number(s):: 7190581

Application Number:: 11/032,771

Assignee:: Midwest Research Institute (Kansas City, MO)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

Show more

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2224/32225 - the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L25/072 - {the devices being arranged next to each other}
H01L23/473 - by flowing liquids {
H01L23/3677 - {Wire-like or pin-like cooling fins or heat sinks}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/13091 - Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/49002 - Electrical device making

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/1305 - Bipolar Junction Transistor [BJT]
H01L2224/291 - with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L2924/014 - Solder alloys
H01L2924/13055 - Insulated gate bipolar transistor [IGBT]

Show less

DOE Contract Number:: AC36-99GO10337

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Citation Formats


                    Hassani, Vahab, Vlahinos, Andreas, and Bharathan, Desikan. Low thermal resistance power module assembly.  United States: N. p., 2007. 
        Web.

Copy to clipboard


                    Hassani, Vahab, Vlahinos, Andreas, & Bharathan, Desikan. Low thermal resistance power module assembly.  United States.

Copy to clipboard


                    Hassani, Vahab, Vlahinos, Andreas, and Bharathan, Desikan. Tue .  
        "Low thermal resistance power module assembly".  United States.  https://www.osti.gov/servlets/purl/1007934.

Copy to clipboard


                    
@article{osti_1007934,

  title        = {Low thermal resistance power module assembly},

  author       = {Hassani, Vahab and Vlahinos, Andreas and Bharathan, Desikan},

  abstractNote = {A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2007},

  month        = {3}

}

Copy to clipboard

Patent:

Save / Share:

Export Metadata

Save to My Library

Similar Records in DOE Patents and OSTI.GOV collections:

Low thermal resistance power module assembly

Patent Hassani, Vahab [Denver, CO]; Vlahinos, Andreas [Castle Rock, CO]; Bharathan, Desikan [Arvada, CO]

A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate from a lower surface (411) to an upper surface (412). A circuit substrate (420) is provided and positioned on the spreader plate (410) to cover the coolant passageways. The circuit substrate (420) includes a bonding layer (422) configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layermore » « less
Full Text Available
Systems and methods for monitoring a power-generation module assembly after a power-generation module shutdown event

Patent Buenaventura, Don; Bowman, Doug

Embodiments are directed to providing a user interface (UI) that streamlines and simplifies the process of monitoring critical power-generation module (PGM) parameters after a PGM assembly is shutdown. The UI displays, in real-time, indicators corresponding to one or more post-shutdown PGM parameters. The UI provides indications of whether the post-shutdown PGM parameters meet post-shutdown criteria of the PGM assembly. When a post-shutdown PGM parameter does not meet the post-shutdown criteria, a user alert is provided to the user. A protocol may additionally be provided to the user. In some embodiments, the protocol may enable the user to return the PGMmore » « less
Full Text Available
Systems and methods for monitoring a power-generation module assembly after a power-generation module shutdown event

Patent Buenaventura, Don; Bowman, Doug

Embodiments are directed to providing a user interface (UI) that streamlines and simplifies the process of monitoring critical power-generation module (PGM) parameters after a PGM assembly is shutdown. The UI displays, in real-time, indicators corresponding to one or more post-shutdown PGM parameters. The UI provides indications of whether the post-shutdown PGM parameters meet post-shutdown criteria of the PGM assembly. When a post-shutdown PGM parameter does not meet the post-shutdown criteria, a user alert is provided to the user. A protocol may additionally be provided to the user. In some embodiments, the protocol may enable the user to return the PGMmore » « less
Full Text Available
Method and device for a high temperature vacuum-safe solder resist utilizing laser ablation of solderable surfaces for an electronic module assembly

Patent Stabach, Jennifer; McPherson, Brice; O'Neal, Chad B.

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.
Full Text Available
Power module assembly with reduced inductance

Patent Ward, Terence G.; Stancu, Constantin C.; Jaksic, Marko; ...

A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly.more » « less
Full Text Available

Similar Records