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Title: Low thermal resistance power module assembly

Abstract

A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate from a lower surface (411) to an upper surface (412). A circuit substrate (420) is provided and positioned on the spreader plate (410) to cover the coolant passageways. The circuit substrate (420) includes a bonding layer (422) configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer (422) may be solder material which bonds to the upper surface (412) of the plate to provide a continuous seal around the upper edge of each opening (414) in the plate. The assembly includes power modules (430) mounted on the circuit substrate (420) on a surface opposite the bonding layer (422). The power modules (430) are positioned over or proximal to the coolant passageways.

Inventors:
 [1];  [2];  [3]
  1. Denver, CO
  2. Castle Rock, CO
  3. Arvada, CO
Issue Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1006409
Patent Number(s):
7859846
Application Number:
11/569,248
Assignee:
Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
DOE Contract Number:  
AC36-99GO10337
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Hassani, Vahab, Vlahinos, Andreas, and Bharathan, Desikan. Low thermal resistance power module assembly. United States: N. p., 2010. Web.
Hassani, Vahab, Vlahinos, Andreas, & Bharathan, Desikan. Low thermal resistance power module assembly. United States.
Hassani, Vahab, Vlahinos, Andreas, and Bharathan, Desikan. Tue . "Low thermal resistance power module assembly". United States. https://www.osti.gov/servlets/purl/1006409.
@article{osti_1006409,
title = {Low thermal resistance power module assembly},
author = {Hassani, Vahab and Vlahinos, Andreas and Bharathan, Desikan},
abstractNote = {A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate from a lower surface (411) to an upper surface (412). A circuit substrate (420) is provided and positioned on the spreader plate (410) to cover the coolant passageways. The circuit substrate (420) includes a bonding layer (422) configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer (422) may be solder material which bonds to the upper surface (412) of the plate to provide a continuous seal around the upper edge of each opening (414) in the plate. The assembly includes power modules (430) mounted on the circuit substrate (420) on a surface opposite the bonding layer (422). The power modules (430) are positioned over or proximal to the coolant passageways.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2010},
month = {12}
}

Patent:

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