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Title: Method for rapid, controllable growth and thickness, of epitaxial silicon films

Abstract

A method of producing epitaxial silicon films on a c-Si wafer substrate using hot wire chemical vapor deposition by controlling the rate of silicon deposition in a temperature range that spans the transition from a monohydride to a hydrogen free silicon surface in a vacuum, to obtain phase-pure epitaxial silicon film of increased thickness is disclosed. The method includes placing a c-Si substrate in a HWCVD reactor chamber. The method also includes supplying a gas containing silicon at a sufficient rate into the reaction chamber to interact with the substrate to deposit a layer containing silicon thereon at a predefined growth rate to obtain phase-pure epitaxial silicon film of increased thickness.

Inventors:
 [1];  [2];  [3];  [3]
  1. Littleton, CO
  2. Golden, CO
  3. Boulder, CO
Issue Date:
Research Org.:
Midwest Research Institute, Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1001799
Patent Number(s):
7601215
Application Number:
11/560,886
Assignee:
Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Classifications (CPCs):
C - CHEMISTRY C30 - CRYSTAL GROWTH C30B - SINGLE-CRYSTAL-GROWTH
DOE Contract Number:  
AC36-99GO10337
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Wang, Qi, Stradins, Paul, Teplin, Charles, and Branz, Howard M. Method for rapid, controllable growth and thickness, of epitaxial silicon films. United States: N. p., 2009. Web.
Wang, Qi, Stradins, Paul, Teplin, Charles, & Branz, Howard M. Method for rapid, controllable growth and thickness, of epitaxial silicon films. United States.
Wang, Qi, Stradins, Paul, Teplin, Charles, and Branz, Howard M. Tue . "Method for rapid, controllable growth and thickness, of epitaxial silicon films". United States. https://www.osti.gov/servlets/purl/1001799.
@article{osti_1001799,
title = {Method for rapid, controllable growth and thickness, of epitaxial silicon films},
author = {Wang, Qi and Stradins, Paul and Teplin, Charles and Branz, Howard M},
abstractNote = {A method of producing epitaxial silicon films on a c-Si wafer substrate using hot wire chemical vapor deposition by controlling the rate of silicon deposition in a temperature range that spans the transition from a monohydride to a hydrogen free silicon surface in a vacuum, to obtain phase-pure epitaxial silicon film of increased thickness is disclosed. The method includes placing a c-Si substrate in a HWCVD reactor chamber. The method also includes supplying a gas containing silicon at a sufficient rate into the reaction chamber to interact with the substrate to deposit a layer containing silicon thereon at a predefined growth rate to obtain phase-pure epitaxial silicon film of increased thickness.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2009},
month = {10}
}

Works referenced in this record:

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Low temperature epitaxial silicon film growth using high vacuum electron‐cyclotron‐resonance plasma deposition
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Low-temperature epitaxial growth of Si by electron cyclotron resonance chemical vapor deposition
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Atomic Structure of Clean Si(113) Surfaces: Theory and Experiment
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How deposition parameters control growth dynamics of nc-Si deposited by hot-wire chemical vapor deposition
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Hot-wire CVD-grown epitaxial Si films on Si (100) substrates and a model of epitaxial breakdown
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Self-consistent pseudopotential calculations for Si (111) surfaces: Unreconstructed (1×1) and reconstructed (2×1) model structures
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Explanation of the limiting thickness observed in low-temperature silicon epitaxy
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