Method for rapid, controllable growth and thickness, of epitaxial silicon films
Abstract
A method of producing epitaxial silicon films on a c-Si wafer substrate using hot wire chemical vapor deposition by controlling the rate of silicon deposition in a temperature range that spans the transition from a monohydride to a hydrogen free silicon surface in a vacuum, to obtain phase-pure epitaxial silicon film of increased thickness is disclosed. The method includes placing a c-Si substrate in a HWCVD reactor chamber. The method also includes supplying a gas containing silicon at a sufficient rate into the reaction chamber to interact with the substrate to deposit a layer containing silicon thereon at a predefined growth rate to obtain phase-pure epitaxial silicon film of increased thickness.
- Inventors:
-
- Littleton, CO
- Golden, CO
- Boulder, CO
- Issue Date:
- Research Org.:
- Midwest Research Institute, Kansas City, MO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1001799
- Patent Number(s):
- 7601215
- Application Number:
- 11/560,886
- Assignee:
- Alliance for Sustainable Energy, LLC (Golden, CO)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C30 - CRYSTAL GROWTH C30B - SINGLE-CRYSTAL-GROWTH
- DOE Contract Number:
- AC36-99GO10337
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Wang, Qi, Stradins, Paul, Teplin, Charles, and Branz, Howard M. Method for rapid, controllable growth and thickness, of epitaxial silicon films. United States: N. p., 2009.
Web.
Wang, Qi, Stradins, Paul, Teplin, Charles, & Branz, Howard M. Method for rapid, controllable growth and thickness, of epitaxial silicon films. United States.
Wang, Qi, Stradins, Paul, Teplin, Charles, and Branz, Howard M. Tue .
"Method for rapid, controllable growth and thickness, of epitaxial silicon films". United States. https://www.osti.gov/servlets/purl/1001799.
@article{osti_1001799,
title = {Method for rapid, controllable growth and thickness, of epitaxial silicon films},
author = {Wang, Qi and Stradins, Paul and Teplin, Charles and Branz, Howard M},
abstractNote = {A method of producing epitaxial silicon films on a c-Si wafer substrate using hot wire chemical vapor deposition by controlling the rate of silicon deposition in a temperature range that spans the transition from a monohydride to a hydrogen free silicon surface in a vacuum, to obtain phase-pure epitaxial silicon film of increased thickness is disclosed. The method includes placing a c-Si substrate in a HWCVD reactor chamber. The method also includes supplying a gas containing silicon at a sufficient rate into the reaction chamber to interact with the substrate to deposit a layer containing silicon thereon at a predefined growth rate to obtain phase-pure epitaxial silicon film of increased thickness.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2009},
month = {10}
}
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