Materials Data on TiCu by Materials Project

doi:10.17188/1187765

Title: Materials Data on TiCu by Materials Project

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Abstract

TiCu is Tetraauricupride structured and crystallizes in the cubic Pm-3m space group. The structure is three-dimensional. Ti is bonded in a body-centered cubic geometry to eight equivalent Cu atoms. All Ti–Cu bond lengths are 2.66 Å. Cu is bonded in a body-centered cubic geometry to eight equivalent Ti atoms.

Publication Date:: 2020-07-14

Other Number(s):: mp-11364

DOE Contract Number:: AC02-05CH11231

Research Org.:: LBNL Materials Project; Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)

Sponsoring Org.:: USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)

Collaborations:: The Materials Project; MIT; UC Berkeley; Duke; U Louvain

Subject:: 36 MATERIALS SCIENCE; Cu-Ti; TiCu; crystal structure

OSTI Identifier:: 1187765

DOI:: https://doi.org/10.17188/1187765

Citation Formats


                    Materials Data on TiCu by Materials Project.  United States: N. p., 2020. 
        Web.  doi:10.17188/1187765.

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                    Materials Data on TiCu by Materials Project.  United States.  doi:https://doi.org/10.17188/1187765

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                    2020.  
"Materials Data on TiCu by Materials Project".  United States.  doi:https://doi.org/10.17188/1187765.  https://www.osti.gov/servlets/purl/1187765. Pub date:Tue Jul 14 04:00:00 UTC 2020

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@article{osti_1187765,

  title        = {Materials Data on TiCu by Materials Project},

  
  abstractNote = {TiCu is Tetraauricupride structured and crystallizes in the cubic Pm-3m space group. The structure is three-dimensional. Ti is bonded in a body-centered cubic geometry to eight equivalent Cu atoms. All Ti–Cu bond lengths are 2.66 Å. Cu is bonded in a body-centered cubic geometry to eight equivalent Ti atoms.},

  doi          = {10.17188/1187765},

  journal      = {},

  number       = ,

  volume       = ,

  place        = {United States},

  year         = {2020},

  month        = {7}

}

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DOI: https://doi.org/10.17188/1187765

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