U.S. Department of EnergyOffice of Scientific and Technical Information
Materials Data on NdCu9Sn4 by Materials Project
Abstract
NdCu9Sn4 is Bergman Structure: Mg32(Al,Zn)49 Bergman-like structured and crystallizes in the tetragonal I4/mcm space group. The structure is three-dimensional. Nd is bonded in a 8-coordinate geometry to sixteen Cu and eight equivalent Sn atoms. There are eight shorter (3.59 Å) and eight longer (3.63 Å) Nd–Cu bond lengths. All Nd–Sn bond lengths are 3.50 Å. There are three inequivalent Cu sites. In the first Cu site, Cu is bonded in a 12-coordinate geometry to two equivalent Nd, six Cu, and four equivalent Sn atoms. There are a spread of Cu–Cu bond distances ranging from 2.52–3.00 Å. There are two shorter (2.75 Å) and two longer (2.80 Å) Cu–Sn bond lengths. In the second Cu site, Cu is bonded in a 12-coordinate geometry to two equivalent Nd, six Cu, and four equivalent Sn atoms. There are a spread of Cu–Cu bond distances ranging from 2.54–2.67 Å. There are a spread of Cu–Sn bond distances ranging from 2.58–2.69 Å. In the third Cu site, Cu is bonded in a cuboctahedral geometry to eight Cu and four equivalent Sn atoms. All Cu–Sn bond lengths are 2.76 Å. Sn is bonded in a 11-coordinate geometry to two equivalent Nd and nine Cu atoms.
- Authors:
- Publication Date:
- Other Number(s):
- mp-607080
- DOE Contract Number:
- AC02-05CH11231; EDCBEE
- Research Org.:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). LBNL Materials Project
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES)
- Collaborations:
- MIT; UC Berkeley; Duke; U Louvain
- Subject:
- 36 MATERIALS SCIENCE
- Keywords:
- crystal structure; NdCu9Sn4; Cu-Nd-Sn
- OSTI Identifier:
- 1277536
- DOI:
- https://doi.org/10.17188/1277536
Citation Formats
The Materials Project. Materials Data on NdCu9Sn4 by Materials Project. United States: N. p., 2020.
Web. doi:10.17188/1277536.
The Materials Project. Materials Data on NdCu9Sn4 by Materials Project. United States. doi:https://doi.org/10.17188/1277536
The Materials Project. 2020.
"Materials Data on NdCu9Sn4 by Materials Project". United States. doi:https://doi.org/10.17188/1277536. https://www.osti.gov/servlets/purl/1277536. Pub date:Thu Jul 23 00:00:00 EDT 2020
@article{osti_1277536,
title = {Materials Data on NdCu9Sn4 by Materials Project},
author = {The Materials Project},
abstractNote = {NdCu9Sn4 is Bergman Structure: Mg32(Al,Zn)49 Bergman-like structured and crystallizes in the tetragonal I4/mcm space group. The structure is three-dimensional. Nd is bonded in a 8-coordinate geometry to sixteen Cu and eight equivalent Sn atoms. There are eight shorter (3.59 Å) and eight longer (3.63 Å) Nd–Cu bond lengths. All Nd–Sn bond lengths are 3.50 Å. There are three inequivalent Cu sites. In the first Cu site, Cu is bonded in a 12-coordinate geometry to two equivalent Nd, six Cu, and four equivalent Sn atoms. There are a spread of Cu–Cu bond distances ranging from 2.52–3.00 Å. There are two shorter (2.75 Å) and two longer (2.80 Å) Cu–Sn bond lengths. In the second Cu site, Cu is bonded in a 12-coordinate geometry to two equivalent Nd, six Cu, and four equivalent Sn atoms. There are a spread of Cu–Cu bond distances ranging from 2.54–2.67 Å. There are a spread of Cu–Sn bond distances ranging from 2.58–2.69 Å. In the third Cu site, Cu is bonded in a cuboctahedral geometry to eight Cu and four equivalent Sn atoms. All Cu–Sn bond lengths are 2.76 Å. Sn is bonded in a 11-coordinate geometry to two equivalent Nd and nine Cu atoms.},
doi = {10.17188/1277536},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Jul 23 00:00:00 EDT 2020},
month = {Thu Jul 23 00:00:00 EDT 2020}
}