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Title: Glue Film Thickness Measurements by Spectral Reflectance

Technical Report ·
DOI:https://doi.org/10.2172/991875· OSTI ID:991875

Spectral reflectance was used to determine the thickness of thin glue layers in a study of the effect of the glue on radiance and reflectance measurements of shocked-tin substrates attached to lithium fluoride windows. Measurements based on profilometry of the components were found to be inaccurate due to flatness variations and deformation of the tin substrate under pressure during the gluing process. The accuracy of the spectral reflectance measurements were estimated to be ±0.5 μm, which was sufficient to demonstrate a convincing correlation between glue thickness and shock-generated light.

Research Organization:
National Security Technologies, LLC (United States)
Sponsoring Organization:
USDOE; USDOE National Nuclear Security Administration (NA)
DOE Contract Number:
DE-AC52-06NA25946
OSTI ID:
991875
Report Number(s):
DOE/NV/25946-1078; TRN: US1007640
Country of Publication:
United States
Language:
English