skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Electrical assembly having heat sink protrusions

Abstract

An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.

Inventors:
;
Publication Date:
Research Org.:
Rinehart Motion Systems, LLC, Wilsonville, OR (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
986562
Patent Number(s):
7,521,789
Application Number:
11/017,184; TRN: US201018%%38
Assignee:
Rinehart Motion Systems, LLC (Wilsonville, OR)
DOE Contract Number:  
FG02-03ER83768
Resource Type:
Patent
Resource Relation:
Patent File Date: 2004 Dec 18
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; COPPER; HEAT SINKS; SEMICONDUCTOR DEVICES; SUBSTRATES; DESIGN; TEMPERATURE CONTROL

Citation Formats

Rinehart, Lawrence E., and Romero, Guillermo L. Electrical assembly having heat sink protrusions. United States: N. p., 2009. Web.
Rinehart, Lawrence E., & Romero, Guillermo L. Electrical assembly having heat sink protrusions. United States.
Rinehart, Lawrence E., and Romero, Guillermo L. Tue . "Electrical assembly having heat sink protrusions". United States. https://www.osti.gov/servlets/purl/986562.
@article{osti_986562,
title = {Electrical assembly having heat sink protrusions},
author = {Rinehart, Lawrence E. and Romero, Guillermo L.},
abstractNote = {An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.},
doi = {},
url = {https://www.osti.gov/biblio/986562}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2009},
month = {4}
}

Patent:

Save / Share: